Methyl phenyl vinyl borosilicate resin and preparation method and application thereof
A technology of methylphenylvinyl boron and silicone resin, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that the reliability of epoxy resin packaging materials, UV resistance and thermal aging performance cannot meet the requirements of packaging materials, and achieve Conducive to safe production, less investment in equipment, and reduced procedures
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0025] Embodiment 1: Preparation of methylphenylvinyl borosilicate resin
[0026] The molar ratio of monophenyltrimethoxysilane, methylphenyldimethoxysilane, tetramethyldivinyldisiloxane, boric acid and methylvinyldimethoxysilane is 0.214:0.135:0.009:0.081 : 0.093 for hydrolysis and polycondensation reaction, nitrogen protection 15% trifluoromethanesulfonic acid 50mL, hydrolysis reaction solvent is methyl isobutyl ketone 110mL, hydrolysis temperature is set at 50 ℃, reaction for 8h, cooling after hydrolysis, and separating the water layer , the methyl isobutyl ketone layer was washed with water for 3-4 times to neutrality, and after the methyl isobutyl ketone was recovered by distillation under reduced pressure, the low boilers were removed at 165°C and the pressure -0.095Mpa to obtain methyl phenyl ethylene based borosilicate resin.
[0027] Ph / R=0.48, R / Si=1.6, B / Si=0.18, Vi / Si=0.24 (atomic ratio), and the refractive index measured by Abbe refractometer is 1.52. The obtai...
Embodiment 2
[0028] Embodiment 2: Preparation of methylphenylvinyl borosilicate resin
[0029] The molar ratio of monophenyltrimethoxysilane, diphenyldimethoxysilane, tetramethyldivinyldisiloxane, boric acid, dimethyldiethoxysilane and vinyltrimethoxysilane is 0.214: 0.066: 0.043: 0.065: 0.012: 0.020 Carry out hydrolysis polycondensation reaction, nitrogen protection, 18% hydrochloric acid 50mL, hydrolysis reaction solvent is 100mL xylene, hydrolysis temperature is set at 60°C, react for 4h, cool after hydrolysis, and separate the water layer , Wash the xylene layer with water for 3-4 times to neutrality. After recovering the xylene by distillation under reduced pressure, remove low boilers at 155°C and pressure -0.095Mpa to obtain methylphenylvinyl borosilicate resin.
[0030] Ph / R=0.53, R / Si=1.6, B / Si=0.16, Vi / Si=0.27 (atomic ratio), and the refractive index measured by Abbe refractometer is 1.53. The obtained methylphenylvinyl borosilicate resin will not turn black and carbonized whe...
Embodiment 3
[0031] Embodiment 3: Preparation of methylphenylvinyl borosilicate resin
[0032]The molar ratio of monophenyltrimethoxysilane, methylphenyldimethoxysilane, tetramethyldivinyldisiloxane, boric acid, methylvinyldimethoxysilane and vinyltrimethoxysilane is 0.241: 0.135: 0.009: 0.081: 0.093: 0.020 for hydrolysis polycondensation reaction, nitrogen protection, 16% sulfuric acid 50mL, hydrolysis reaction solvent is toluene 110mL, hydrolysis temperature is set at 50 ℃, reaction 6h, cooling after hydrolysis, and separating water The toluene layer was washed with water for 3-4 times to neutrality. After the toluene was recovered by distillation, the low boilers were removed at 165°C and the pressure -0.095Mpa to obtain methylphenyl vinyl borosilicate resin.
[0033] Ph / R=0.49, R / Si=1.5, B / Si=0.16, Vi / Si=0.26 (atomic ratio), the refractive index measured by Abbe refractometer is 1.52. The obtained methylphenylvinyl borosilicate resin will not turn black and carbonized when placed at...
PUM
Property | Measurement | Unit |
---|---|---|
tensile strength | aaaaa | aaaaa |
refractive index | aaaaa | aaaaa |
refractive index | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com