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Bending-resistant aluminum-base copper-clad laminate and preparation method thereof

An aluminum-based copper clad and bent technology, which is applied in lamination, lamination devices, chemical instruments and methods, etc.

Inactive Publication Date: 2015-05-20
广东全宝科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are few bending-resistant aluminum substrates with excellent performance in the market at present.

Method used

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  • Bending-resistant aluminum-base copper-clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1. Take an appropriate amount of acetone solvent (based on the ability to dissolve the curing agent and accelerator) and fully stir and dissolve 3 parts of diaminodiphenylmethane and 1 part of 2-methylimidazole;

[0025] 2. Add 20 parts of bisphenol-A epoxy resin, 10 parts of nitrile rubber, and 30 parts of filler to the dissolved product obtained in step 1 in sequence, stir for more than 4 hours, and mix well to form a high thermal conductivity resin composition; Described bisphenol A type epoxy resin epoxy equivalent is 430, and described nitrile rubber Mooney viscosity is 30, and described filler is aluminum oxide;

[0026] 3. Coat the high thermal conductivity resin composition obtained in step 2) on the rolled copper foil with excellent flexural properties, and bake in a tunnel oven at 100°C for 5 minutes, then cut and combine with the thin bending-resistant type The aluminum plates are stacked and then laminated in a hot press to obtain a bending-resistant aluminu...

Embodiment 2

[0028] 1. Take an appropriate amount of acetone solvent (based on the ability to dissolve the curing agent and accelerator) and fully stir and dissolve 1 part of diaminodiphenylmethane and 2 parts of 2-methylimidazole;

[0029] 2. Add 40 parts of bisphenol A epoxy resin, 30 parts of nitrile rubber, and 70 parts of boron nitride filler to the solution obtained in step 1 in sequence, stir for more than 4 hours, and mix well to form a high thermal conductivity resin composition ;

[0030] 3. Coat the above-mentioned high thermal conductivity resin composition on the calendered copper foil with excellent flexural properties, and bake in a tunnel oven at 160°C for 3-5 minutes, then cut and combine with a thin bending-resistant aluminum plate After lamination, enter the hot press machine for lamination, and obtain a bending-resistant aluminum-based copper-clad laminate with excellent bending resistance.

Embodiment 3

[0032] 1. Take an appropriate amount of acetone solvent (based on the ability to dissolve the curing agent and accelerator) and fully stir and dissolve 3 parts of diaminodiphenylsulfone and 1 part of N-methylimidazole;

[0033] 2. Add 30 parts of bisphenol A epoxy resin, 20 parts of chloroprene rubber, and 50 parts of alumina filler to the solution obtained in step 1 in sequence, stir for more than 4 hours, and mix well to form a high thermal conductivity resin composition;

[0034] 3. Coat the above-mentioned high thermal conductivity resin composition on the rolled copper foil with excellent flexural properties, and bake in a tunnel oven at 100-160°C for 3-5 minutes, then cut and combine with thin bending-resistant Aluminum-based copper-clad laminates with excellent bending resistance can be obtained by laminating them in a hot press machine.

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Abstract

The invention relates to an aluminum-base copper-clad laminate, particularly a bending-resistant aluminum-base copper-clad laminate and a preparation method thereof. The bending-resistant aluminum-base copper-clad laminate comprises an insulation layer, wherein the insulation layer is mainly composed of 20-40 parts of bisphenol A epoxy resin, 10-30 parts of toughener, 30-70 parts of filler, 1-10 parts of curing agent and 0.1-2 parts of accelerator. The toughener is one or more of nitrile-butadiene rubber, chloroprene rubber and polyvinyl butyral. The nitrile-butadiene rubber, chloroprene rubber, polyvinyl butyral or the like with excellent toughening effect is utilized to modify the epoxy resin, thereby forming the high-bending-resistance insulation layer of modified epoxy resin polymer. The bending-resistant aluminum-base copper-clad laminate can be bent by more than 90 degrees (R=3.0mm) when the back aluminum plate has no V slot. When the back aluminum plate has a V slot, the copper-clad laminate can be bent by more than 90 degrees (R=2.0mm), and the insulation layer and copper foil have no crack on the appearance.

Description

technical field [0001] The invention relates to an aluminum-based copper-clad laminate, in particular to a bending-resistant aluminum-based copper-clad laminate and a preparation method thereof. Background technique [0002] With the development of LED lighting applications, the shape of LED design is evolving in a three-dimensional and 3D manner. There is an urgent need for aluminum-based copper-clad laminates with excellent bending resistance. The bending-resistant aluminum substrate can meet the three-dimensional and multi-directional requirements of terminal LEDs. Lighting requirements, cost reduction, flexible design, and smaller size can be designed, which is in line with the application trend of light and thin LED products, high integration, and small size. However, there are few bending-resistant aluminum substrates with excellent performance in the market at present. Contents of the invention [0003] In order to solve the above problems, the present invention u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L9/02C08L11/00C08L29/14C08K3/22C08K3/38C08K3/28C08K3/34B32B15/092B32B15/20B32B37/02
Inventor 罗君林晨
Owner 广东全宝科技股份有限公司
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