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Fluorescent powder glue coating method and application thereof

A phosphor and glue coating technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of phosphor deposition process and complexity, and achieve the effects of improving luminous efficiency, suppressing white light, and improving packaging efficiency

Inactive Publication Date: 2015-05-27
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a coating method of phosphor glue and its application, the purpose of which is to preheat the substrate and then coat the phosphor powder to obtain a large curvature ball with uniform phosphor distribution. The geometric shape of the cap-shaped phosphor powder and the geometric shape of the layered multi-concentration phosphor powder ensure the light output efficiency, color temperature, and spatial color uniformity of the LED, thus solving the problem of phosphor precipitation and phosphor deposition caused by the current phosphor coating method. Technical problems such as complex process

Method used

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  • Fluorescent powder glue coating method and application thereof
  • Fluorescent powder glue coating method and application thereof
  • Fluorescent powder glue coating method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0044] This embodiment is used for array packaging, and its substrate is made of planar aluminum material. Firstly, the substrate is heated to 100°C, and 2ul of fluorescent powder glue with a concentration of 2g / ml is injected on the planar substrate with a syringe. Powder glue is epoxy resin glue containing TAG fluorescent powder. After injecting the phosphor glue, after injecting the phosphor glue, the phosphor glue is stably molded and solidified within 4 minutes, and then it changes from a gel state to a solid state within 40 minutes to complete the curing.

[0045] The test found that the shape of the fluorescent powder glue is spherical cap shape, and the curvature of the spherical cap-shaped phosphor powder glue is 35°.

Embodiment 2

[0047] This embodiment is used for system packaging, and its substrate is made of planar copper material. First, the substrate is heated to 120°C, and 2 ul of fluorescent powder glue with a concentration of 0.3g / ml is injected on the planar substrate with a syringe. Powder glue is TAG fluorescent powder contained in liquid glass. After injecting the phosphor glue, the phosphor glue was stably molded and cured within 3 minutes, and then completely changed from a gel state to a solid state within 20 minutes to complete the curing.

[0048] The test found that the shape of the fluorescent powder glue is spherical cap shape, and the curvature of the spherical cap-shaped phosphor powder glue is 50°.

Embodiment 3

[0050] This embodiment is used for printed circuit board packaging, and its substrate is a planar silicon material. First, the substrate is heated to 150° C., and 1 ul of phosphor glue with a concentration of 0.3 g / ml is injected on the planar substrate with a syringe. The fluorescent powder glue contains TAG fluorescent powder in silica gel. After injecting the phosphor glue, the phosphor glue was stably molded and solidified within 2 minutes, and then completely changed from a gel state to a solid state within 10 minutes to complete the curing.

[0051] The test found that the shape of the fluorescent powder glue is spherical cap shape, and the curvature of the spherical cap-shaped phosphor powder glue is 70°.

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Abstract

The invention discloses a fluorescent powder glue coating method and application thereof, and belongs to the field of LED packaging. Before fluorescent powder glue coating, a substrate is heated to a temperature at which fluorescent powder glue can solidify, wherein the temperature range is 100 to 175 DEG C, 175 to 250 DEG C or 100 to 250 DEG C; then the fluorescent powder glue is coated to ensure that coating and solidifying of the fluorescent powder glue are fulfilled synchronously, that is, the fluorescent powder glue is coated efficiently. Through temperature adjustment of the substrate, the fluorescent powder glue can have a high-curvature ball-cap geometric appearance which cannot be formed according to the conventional free glue dispensing manner. As coating and solidifying are fulfilled synchronously, repeated and layered coating can be realized, and the method provided by the invention can be used for preparing a multi-layer appearance of the fluorescent powder glue. The method provided by the invention is simple to operate and low in cost, can greatly prevent fluorescent powder precipitation during white-light LED packaging, can obtain a high-curvature and multi-layer geometric appearance of the fluorescent powder glue, and can improve the space color uniformity and optical consistency of an LED product.

Description

technical field [0001] The invention belongs to the field of LED packaging, and more specifically relates to a high-efficiency fluorescent powder glue coating method based on substrate heating and its application. Background technique [0002] LED (Light Emitting Diode) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optic conversion efficiency, high color rendering coefficient, long service life, environmental protection and energy saving, and small size. It is known as 21 Century green lighting source. Due to the unique advantages of LED, it has been widely used in many fields, and is considered by the industry to be the main development direction of lighting technology in the future, with huge market potential. [0003] High-power white LEDs are usually mixed with two wavelengths of blue light and yellow light or three-wavelength light of blue light, green light and red light. Due...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50
CPCH01L33/50H01L33/505H01L2933/0041
Inventor 罗小兵余兴建谢斌商博锋
Owner HUAZHONG UNIV OF SCI & TECH
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