A continuous direct electroplating device for extremely fine metal wire

Abstract

The invention discloses a continuous and direct electroplating device for a very fine metal wire, and belongs to the field of thermal surface treatment of a very fine metal material. The continuous and direct electroplating device comprises a tank, wherein a plurality of partition boards are arranged in the tank, the tank is divided into seven groups of closed chambers by the partition boards, a wire paying-off system is arranged at the leftmost end of the tank, a wire collecting system is arranged at the right end of the tank, a cylinder is arranged below each chamber of the seven groups of closed chambers, a pump or machine is arranged in each cylinder and connected with the corresponding closed chamber through a pipeline, and the whole set of device is provided with a precision current control system, so that functions of each component are exerted; the precision current control system comprises a control switch, a rectifier and a precision milliammeter. The device can directly perform direct electroplating and film covering treatment on an ordinary and very fine wire instead of a precious metal wire, and the product cost is reduced; meanwhile, due to miniature and closed design, a tank liquid and a cylinder liquid can be recycled and are not discharged, and accordingly, environment pollution is prevented.

Description

technical field [0001] The invention relates to an extremely fine metal wire continuous direct electroplating device, which belongs to the field of heat treatment of the surface of fine metal materials. Background technique [0002] In the industry using fine metal wires, due to the high price and high cost of gold, it is necessary to replace it with lower-cost metals, but most of the replacement materials need to be coated on the surface of the wire, in order to use the coated film Improve the anti-oxidation and vulcanization ability of the wire and improve the mechanical properties; for example: typical semiconductor devices and LED chip bonding silver wires and copper wires are easily oxidized, and surface plating treatment is required; in the photovoltaic cell industry, copper wires can be used Wire instead of printing silver paste as the gate electrode, but because of the corrosion reaction between copper and polysilicon wafers for batteries, nickel or silver plating is...

AI Technical Summary

Problems solved by technology

The existing electroplating technology, whether it is rack plating, barrel plating or winding plating, is relatively easy to process massive objects or larger-sized workpieces one at a time, and there is no such method for large-scale continuous processing of continuous micro-filaments. equipment

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