A modified inorganic fireproof glue
A fireproof glue, inorganic technology, applied in the field of materials, can solve problems such as toxicity and poor waterproofness
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Embodiment 1
[0014] The present embodiment adopts non-toxic, harmless inorganic materials, including the following raw materials in weight percentage: 55% sodium silicate, 30% silicon dioxide, 5% aluminum phosphate and 10% magnesium silicate, wherein the particle size of silicon dioxide is between 1-5μm, the purity is greater than 98%; first add sodium silicate, silicon dioxide and magnesium silicate into the enamel reaction kettle, fully react and highly polymerize the inorganic polymer binder formed, and then add aluminum phosphate to cure and modify , to obtain the fireproof glue of the present invention.
Embodiment 2
[0016] This embodiment adopts non-toxic, harmless inorganic materials, including the following raw materials in weight percentage: 45% sodium silicate, 30% silicon dioxide, 15% aluminum phosphate and 10% magnesium silicate, wherein the particle size of silicon dioxide is between 1-3μm, the purity is greater than 95%; first add sodium silicate, silicon dioxide and magnesium silicate into the enamel reaction kettle, fully react and highly polymerize the inorganic polymer binder formed, and then add aluminum phosphate to cure and modify , to obtain the fireproof glue of the present invention.
Embodiment 3
[0018] This embodiment adopts non-toxic, harmless inorganic materials, including the following raw materials in weight percentage: 45% sodium silicate, 30% silicon dioxide, 15% aluminum phosphate and 10% potassium silicate, wherein the particle size of silicon dioxide is between 1-3μm, the purity is greater than 95%; first add sodium silicate, silicon dioxide and magnesium silicate into the enamel reaction kettle, fully react and highly polymerize the inorganic polymer binder formed, and then add aluminum phosphate to cure and modify , to obtain the fireproof glue of the present invention.
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Abstract
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