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High-pressure-resistant flat heat pipe and machining method thereof

A technology of flat heat pipe and high pressure resistance, which is applied in the direction of indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of limiting the use temperature range of flat heat pipes and the pressure resistance of flat heat pipes, so as to broaden the use temperature range and meet the requirements of reflection. Gravity performance, effect of enhancing pressure resistance performance

Active Publication Date: 2015-06-17
SHANGHAI INST OF SATELLITE EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, flat heat pipes using working fluids such as water and alcohol are constrained by the boiling point and condensation point of the working fluid, which severely limits the operating temperature range of flat heat pipes.
If ammonia is used as the working fluid, the operating temperature range of the flat heat pipe can be effectively widened (-50°C to 100°C), but compared with water, alcohol or even acetone, the saturated vapor pressure of ammonia is increased by several tens of times (the saturated vapor pressure of ammonia is more than 60 times that of water), which will bring serious pressure resistance problems to the flat heat pipe

Method used

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  • High-pressure-resistant flat heat pipe and machining method thereof
  • High-pressure-resistant flat heat pipe and machining method thereof
  • High-pressure-resistant flat heat pipe and machining method thereof

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Embodiment Construction

[0038] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0039] In this embodiment, the high-pressure-resistant flat heat pipe provided by the present invention includes an upper cover plate 1, a lower cover plate 3, a capillary cavity 2 and a rib 5;

[0040] Wherein, the upper cover 1 is connected with the lower cover 3 to form a closed cavity; the upper cover 1 is provided with reinforcing ribs 5 arranged in a dot matrix; the reinforcing ribs 5 are evenly arranged on the upper on the inner surface of the cover plate 1. The reinforcing rib 5 is arrang...

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Abstract

The invention provides a high-pressure-resistant flat heat pipe and a machining method thereof. The high-pressure-resistant flat heat pipe comprises an upper cover plate, a lower cover plate, capillary cavities and reinforcing ribs, wherein the upper cover plate is connected with the lower cover plate to form an airtight cavity, the reinforcing ribs arranged into a dot matrix are arranged on the upper cover plate and located in the airtight cavity, the upper cover plate is connected with the lower cover plate through the reinforcing ribs, communicated steam channels are arranged outside the reinforcing ribs, the capillary cavities are formed in the outer surfaces of the reinforcing ribs, and each capillary cavity is provided with a plurality of capillary core structures used for adsorbing liquid-phase working media. By arranging the cubic reinforcing ribs on the upper cover plate evenly, the pressure resistance of the flat heat pipe is improved. The inner surface is filled with the capillary cavities provided with the capillary core structures through sintering, and thus antigravity performance is realized.

Description

technical field [0001] The invention relates to heat dissipation of high-power electronic components, in particular to a flat heat pipe with high pressure resistance and a processing method thereof. Background technique [0002] With the rapid development of microelectronics technology, the miniaturization of electronic components has become the mainstream trend in the development of modern electronic equipment. The feature size of electronic devices continues to decrease, but the integration level, packaging density and operating frequency of chips continue to increase, all of which make the power consumption density higher and higher. However, the high connection density of the chip and the small available heat dissipation area lead to a sharp increase in the heat flux density, and a significant increase in the chip temperature seriously affects its working reliability and service life. The energy consumption and heat dissipation of the chip have become the key to restrict...

Claims

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Application Information

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IPC IPC(8): F28D15/04
Inventor 季琨韩玮董学金祝朋王晓占王克寒肖宁斌
Owner SHANGHAI INST OF SATELLITE EQUIP
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