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Electroconductive paste

A technology of electrical conductivity and paste, applied in conductive coatings, conductive materials, conductive materials, etc., can solve the problems of complex manufacturing process, reduced conductivity of conductor patterns, and suppression of sintering, and achieve the effect of excellent adhesion

Inactive Publication Date: 2015-06-24
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the copper powder is easily oxidized in the atmosphere, it has the disadvantage that, for example, after the conductor pattern is formed on the substrate, the surface of the conductor pattern must be covered with a protective material.
[0007] However, although the conductive paste disclosed in Patent Document 3 improves the soldering heat resistance to a certain extent, it also suppresses the sinterability of silver, so there is a conductor obtained by firing the conductive paste. The problem of the decrease in the conductivity of the pattern
In addition, since the process of covering the surface of the silver powder with a metal material is necessary, there is a problem that the production process becomes complicated.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0094] Hereinafter, examples and comparative examples of the present invention will be described.

[0095] [Raw materials for conductive paste]

[0096] The following (A)-(F) components were mixed according to the ratio of Examples 1-12 described in Table 1 and Table 2, and Comparative Examples 1-7 described in Table 3, and the electroconductive paste was prepared. In addition, the ratio of each component shown in Tables 1-3 is all shown by mass parts.

[0097] (A) silver powder

[0098] Spherical silver powder with an average particle size of 5 μm.

[0099] (B) Glass frit

[0100] Bi with an average particle size of 5.2 μm and a softening point of 440 °C 2 o 3 ·B 2 o 3 Department of glass frit.

[0101] (C) Organic binder

[0102]As the organic binder, what is obtained by dissolving ethyl cellulose resin in butyl carbitol is used. The mixing ratio of ethyl cellulose resin and butyl carbitol is 30:70 (mass ratio).

[0103] (D-1) Alloy powder containing copper, tin, ...

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Abstract

Provided is a sintered-type electroconductive paste having excellent electromigration resistance, solder heat resistance, and adhesion to substrates. This electroconductive paste comprises: (A) silver powder; (B) glass frit; (C) an organic binder; and (D) a powder including copper, tin, and manganese. This electroconductive paste preferably comprises 0.1-5.0 parts by mass of said powder (D) per 100 parts by mass of said silver powder (A).

Description

technical field [0001] This invention relates to the sintering type electroconductive paste which can be used for formation of the conductor pattern of a printed wiring board, for example. Background technique [0002] A conductive paste in which metal particles are dispersed in a vehicle composed of an organic binder and a solvent is known. The conductive paste is used for formation of a conductor pattern of a printed wiring board, formation of an electrode of an electronic component, and the like. Such conductive pastes can be roughly classified into resin-curing types and firing types. The resin hardening type conductive paste is a conductive paste that ensures conductivity by hardening the resin so that the metal particles come into contact with each other. The firing-type conductive paste is a conductive paste that secures conductivity by sintering between metal particles by firing. [0003] As the metal particles contained in the conductive paste, for example, coppe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22C09D5/24C09D7/12C09D201/00H01B1/00H01B5/14H05K1/09H05K3/12
CPCH01B1/16H01B1/22H05K1/092H05K2203/1126C09D7/40C09D5/24C09D201/00H05K1/18H05K3/10H05K2201/032H05K2203/12
Inventor 吉井喜昭
Owner NAMICS CORPORATION
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