Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Stacked body for cof substrate, method for manufacturing such stacked body for cof substrate, and cof film carrier tape formed by using such stacked body for cof substrate

A manufacturing method and technology of laminates, which are applied in the processing of insulating substrates/layers, semiconductor/solid-state device manufacturing, printed circuit manufacturing, etc., can solve problems such as uneven thickness, difficulty in microfabrication, and difficulty in ensuring circuit linearity. , to achieve the effect of excellent electromigration resistance and high adhesion

Inactive Publication Date: 2007-11-21
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the surface roughness of the surface not in contact with the insulating layer is large, thickness unevenness occurs when the resist is formed, and it is difficult to improve the linearity of the circuit in the subsequent pattern formation process of the wiring circuit.
In addition, when the thickness of the conductor is thick, it is also difficult to ensure the linearity of the circuit, especially for microfabrication with a pitch of 30 μm or less.
That is to say, there is no laminate that can meet the requirements of microfabrication with appropriate roughness on the side of the insulating layer and that on the side of the resist surface.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0036] Charge N-methylpyrrolidone in a reaction vessel equipped with a thermocouple and stirrer and capable of introducing nitrogen. After immersing the reaction container in the ice water put into the container, put pyromellitic anhydride (PMDA) into the reaction container, and then put 4,4'-diaminodiphenyl ether (DAPE) and 2'-methoxy - 4,4'-Diamino-N-benzoanilide (MABA). The total amount of monomers charged was 15 wt%, the molar ratio of each diamine (MABA:DAPE) was 60:40, and the molar ratio of acid anhydride and diamine was 0.98:1.0. Then, the stirring was continued, and when the temperature in the reaction container reached the range of room temperature ± 5°C, the reaction container was taken out from the ice water. Stirring was continued for 3 hours at room temperature, and the solution viscosity of the obtained polyamic acid was 15000 cps.

Synthetic example 2

[0038] Charge N-methylpyrrolidone in a reaction vessel equipped with a thermocouple and stirrer and capable of introducing nitrogen. After immersing the reaction container in the ice water put into the container, put PMDA / 3,3',4,4'-biphenyltetracarboxylic dianhydride (BTDA) into the reaction container, and then put 4,4'-diamino Diphenyl ether (DAPE). The total amount of monomers charged was 5% by weight, and the molar ratio of acid anhydride and diamine was 1.03:1.0. Then, the stirring was continued, and when the temperature in the reaction container reached the range of room temperature ± 5°C, the reaction container was taken out from the ice water. Stirring was continued for 3 hours at room temperature, and the solution viscosity of the obtained polyamic acid was 3200 cps.

Synthetic example 3

[0040] Charge N-methylpyrrolidone in a reaction vessel equipped with a thermocouple and stirrer and capable of introducing nitrogen. After immersing the reaction container in the ice water put into the container, put 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride (DSDA) and PMDA into the reaction container, and then put 1,3-bis (4-Aminophenoxy)benzene (TPE-R). The total amount of monomers charged was 15 wt%, the molar ratio of each acid anhydride (DSDA:PMDA) was 90:10, and the molar ratio of acid anhydride and diamine was 1.03:1.0. Then, the stirring was continued, and when the temperature in the reaction container reached the range of room temperature ± 5°C, the reaction container was taken out from the ice water. Stirring was continued for 3 hours at room temperature, and the solution viscosity of the obtained polyamic acid was 3200 cps.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Surface roughnessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

A stacked body which permits wiring of a driver IC chip to be recognized through an insulating layer, has strong adhesion between a conductor and the insulating layer and excellent electromigration resistivity, and to which fine processing, for example, that of a pitch of 30 m or less, can be performed, and a method for manufacturing such stacked body. The stacked body for COF substrate is provided with the insulating layer composed of an insulating resin on one plane of the conductor composed of a conductive metal foil. In the stacked body, the conductor thickness is 1-8 m, the surface roughness Rz of a plane touching the insulating layer of the conductor is 1.0 m or less, and the surface roughness Rz of a plane not touching the insulating layer of the conductor is 1.0 m or less. In the method for manufacturing the stacked body for COF substrate, the insulating layer is formed on the one plane of the conductive metal foil, which has a thickness of at least 10 m and a surface roughness Rz of 1.0 m or less on the one plane, a plane of the conductive metal foil not touching the insulating layer is chemically polished to have a conductive metal foil thickness of 1-8 m and a surface roughness Rz of 1.0 m or less to form the conductor.

Description

technical field [0001] This invention relates to the laminated body for flexible printed wiring boards used as a COF application, and its manufacturing method. Background technique [0002] The TAB method (tape automated bonding) of mounting a driver IC on a carrier tape is widely used in the electronics industry using liquid crystal display elements (LCD). [0003] In addition, COF (chip-on-film), which directly mounts a bare IC chip on a film carrier tape, has been developed recently as a mounting method for higher density mounting in a smaller space. [0004] Since the flexible printed circuit board (FPC) used in this COF does not have the device hole used in the TAB method, it is necessary to identify the wiring of the driver IC chip through the insulating layer when measuring the relative position when the chip is mounted. In particular, in the flexible printed circuit board (FPC) used in this COF, the pitch of the wiring becomes narrower, and microfabrication must be ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/60H05K1/03
CPCH01L2924/0002H05K1/0393H05K1/0269H05K2201/0191H01L21/4846H05K2203/0759H05K2201/0355H05K2201/0108H05K3/002H01L23/4985
Inventor 岸田克也岛田彰德田裕一财部妙子
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com