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Ultraviolet LED lamp encapsulating glue and preparation method thereof

A LED lamp packaging and glue technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of large light attenuation, bluish luminous hue of purple LED, aging and attenuation of chips, etc., to achieve high color rendering, Good effect, less heat generation effect

Active Publication Date: 2015-07-01
广州惠利电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the purple light LED lamps for commercial use have the defect of large time decay when they are lit for a long time. This is the characteristic of the purple light chip. Especially when it is lit for a long time, the chip continues to heat up, causing the chip to work at high temperature to accelerate aging and attenuation.
Moreover, some materials in the glue in the purple LED lamps used in industrialization tend to make the luminous hue of the purple LED turn blue

Method used

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  • Ultraviolet LED lamp encapsulating glue and preparation method thereof
  • Ultraviolet LED lamp encapsulating glue and preparation method thereof
  • Ultraviolet LED lamp encapsulating glue and preparation method thereof

Examples

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preparation example Construction

[0029] The preparation method of a purple light LED lamp packaging glue involved in this embodiment comprises the following steps:

[0030] (1) Weigh one or both of bisphenol A type epoxy resin and cycloaliphatic epoxy resin, add polyethylene glycol epoxy resin, optical brightening agent, defoamer to it and mix uniformly, prepare into A agent;

[0031] (2) dissolving the accelerator in the agent B additive to make an intermediate, weighing one or both of methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride, and mixing them with the prepared intermediate evenly to make agent B;

[0032] (3) Mix the agent A obtained in the step (1) and the agent B obtained in the step (2) uniformly to obtain the product.

Embodiment 1

[0034] This embodiment provides a purple light LED packaging glue (marked as glue 1)

[0035] First take by weighing 98.5g of bisphenol A type epoxy resin, add 0.4g optical brightening agent, 1g polyethylene glycol epoxy resin, 0.1g defoamer (high-boiling point aromatic hydroxy, ketone, ester and polydimethylsiloxane) Among them, the composition of high-boiling aromatic hydroxyl, ketone, and ester comes from the BYK special product of BYK Company (this mixture) is mixed uniformly to make A agent. Dissolve 1 g of benzyltriphenylphosphine chloride in 2 g of ethylene glycol to prepare an intermediate, then weigh 97 g of methylhexahydrophthalic anhydride, mix them uniformly with the prepared intermediate, and prepare B agent. Mix the obtained agent A and the obtained agent B evenly to obtain the purple LED encapsulating glue 1.

Embodiment 2

[0037] This embodiment provides a purple light LED packaging glue (marked as glue 2)

[0038] First take by weighing bisphenol A type epoxy resin 95g, add 4g polyethylene glycol epoxy resin wherein, 0.8g optical brightening agent, 0.2g defoamer (Jiaqian Elifom6800 is modified siloxane) and mix uniformly, Make A agent. Dissolve 1 g of benzyl triphenylphosphine chloride in 2 g of ethylene glycol to make an intermediate, then weigh 60 g of hexahydrophthalic anhydride and 37 g of methyl hexahydrophthalic anhydride, mix them with the prepared intermediate evenly, and prepare Agent B. Mix the obtained agent A and the obtained agent B evenly to obtain the glue 2 for encapsulating purple light LEDs.

[0039] The LED lighting aging values ​​of the purple light LED packaging glue in the embodiment of the present invention and the conventional glue at wavelengths of 370nm, 394nm and 401.2nm are shown in the following table, and see Figure 1-Figure 3 shown.

[0040]

[0041]

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Abstract

The invention discloses ultraviolet LED lamp encapsulating glue and a preparation method thereof. The ultraviolet LED lamp encapsulating glue is prepared from an agent A and an agent B in a mass ratio of 1: 1, wherein the agent A comprises one or more of 95-99% by weight of bisphenol A epoxy resin and cycloaliphatic epoxide resin, 1-3% by weight of an agent A additive, 0.01-1% by weight of an optical brightener, 0.01-1% by weight of a defoamer, 96-99% by weight of one of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride, 0.1-2% by weight of an accelerant and 0.1-4% by weight of an agent B additive. According to the ultraviolet LED lamp encapsulating glue disclosed by the invention, the LED lamp is small in luminous decay, simple to prepare and low in manufacturing cost.

Description

technical field [0001] The invention relates to the field of biochemical materials, in particular to a purple LED lamp packaging glue and a preparation method thereof. Background technique [0002] Ultraviolet LEDs have the characteristics of short wavelength and are suitable for fine sensing. They meet the requirements of high color rendering, low heat generation, and high stability. They are mainly used in special fields, such as sterilization, special biomedical purposes, resin hardening, and semiconductor prevention. Corrosion of circuits, banknote identification purposes (applied to vending machines, etc.), attracting insects (agricultural applications, etc.). [0003] At present, the purple light LED lamps for commercial use have the defect of large time decay when they are lit for a long time. This is the characteristic of the purple light chip. Especially when it is lit for a long time, the chip continues to heat up, causing the chip to work at high temperature to ac...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/08C09J11/06
Inventor 陈梓东李荣张云柱杨敏仪
Owner 广州惠利电子材料有限公司
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