High reliability small outline package (SOP) lead frame and production method of packaging piece

A technology for encapsulating leads and lead frames, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of high cost, low number of frame rows, low material utilization rate, etc., and meet the requirements of low cost, mass use, well-structured effects

Active Publication Date: 2015-07-01
广东韶华科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the perspective of packaging cost, the number of frame rows is low, the material utilization rate is low, and the cost is high

Method used

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  • High reliability small outline package (SOP) lead frame and production method of packaging piece
  • High reliability small outline package (SOP) lead frame and production method of packaging piece
  • High reliability small outline package (SOP) lead frame and production method of packaging piece

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024]A lead frame body with a length L of 269.6±0.10 mm and a width H of 83.0±0.05 mm is manufactured. There are 240 packaging units on the lead frame body, and all the packaging units are arranged in a matrix of 12 rows and 20 columns. The packaging unit includes a carrier, the back of the carrier and along the periphery of the carrier are provided with a frame-shaped structure composed of multiple silver-plated rings, and in the frame-shaped structure, the back of the carrier is provided with a plurality of pits arranged in a square matrix; the carrier There are a plurality of inner pins on both sides, and each inner pin is respectively provided with a locking hole and a V-shaped waterproof groove, and a carrier connecting rod is respectively arranged on the other two sides of the carrier, and one end of the carrier connecting rod is connected to the The carrier is connected, and the size of the other end of the carrier connecting rod is larger than the size of the end conne...

Embodiment 2

[0026] A lead frame body with a length L of 269.6±0.10 mm and a width H of 83.0±0.05 mm is manufactured. There are 240 packaging units on the lead frame body, and all the packaging units are arranged in a matrix of 12 rows and 20 columns. The packaging unit includes a carrier, the back of the carrier and along the periphery of the carrier are provided with a frame-shaped structure composed of multiple silver-plated rings, and in the frame-shaped structure, the back of the carrier is provided with a plurality of pits arranged in a square matrix; the carrier There are a plurality of inner pins on both sides, and each inner pin is respectively provided with a locking hole and a V-shaped waterproof groove, and a carrier connecting rod is respectively arranged on the other two sides of the carrier, and one end of the carrier connecting rod is connected to the The carrier is connected, and the size of the other end of the carrier connecting rod is larger than the size of the end conn...

Embodiment 3

[0028] A lead frame body with a length L of 269.6±0.10 mm and a width H of 83.0±0.05 mm is manufactured. There are 240 packaging units on the lead frame body, and all the packaging units are arranged in a matrix of 12 rows and 20 columns. The packaging unit includes a carrier, the back of the carrier and along the periphery of the carrier are provided with a frame-shaped structure composed of multiple silver-plated rings, and in the frame-shaped structure, the back of the carrier is provided with a plurality of pits arranged in a square matrix; the carrier There are a plurality of inner pins on both sides, and each inner pin is respectively provided with a locking hole and a V-shaped waterproof groove, and a carrier connecting rod is respectively arranged on the other two sides of the carrier, and one end of the carrier connecting rod is connected to the The carrier is connected, and the size of the other end of the carrier connecting rod is larger than the size of the end conn...

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PUM

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Abstract

The invention provides a high reliability small outline package (SOP) lead frame and a production method of a packaging piece. The lead frame comprises a lead frame body with 240 packaging units in matrix arrangement. The packaging unit comprises a carrier. The back of the carrier is provided with a frame-shaped structure comprising a plurality of silver-plated rings. The frame-shaped structure is internally provided with a plurality of pits. Two sides of the carrier are provided with a plurality of inner pins with locking holes and waterproof grooves. The other two side edges of the carrier are respectively provided with a carrier connecting rod. One end of the carrier connecting rod is connected with the carrier. The other end of the carrier connecting rod is large in size and is provided with a stabilizing hole. Wafer backgrinding and scribing are performed according to an existing process; a chip is stuck on the lead frame; baking is performed through a rapid solidification anti-separation layer baking technique in seven different temperature areas; the steps of plasma cleaning, pressure welding, plastic packaging and tendon cutting are carried out; and then printing and testing are performed by a conventional SOP production technique so as to produce the SOP packaging piece. A frame material and a plastic packaging material are utilized to the greatest extent, the production efficiency and product quality are improved, error rate is lowered and safety risk is reduced.

Description

technical field [0001] The invention belongs to the technical field of microelectronic assembly and packaging, and relates to a lead frame for matrix SOP packaging, in particular to a high-reliability SOP packaging lead frame; the invention also relates to a method of using the lead frame to produce packages method. Background technique [0002] Small Outline Package (SOP) is an advanced microelectronics assembly and packaging technology, a mid-range packaging form, and is currently in a mature development stage. The package has the advantages of low failure rate, high density, miniaturization, space saving, and low cost, which can shorten the time to market and reduce investment risk. Although the SOP packaging technology is relatively mature and all packaging companies have mass-produced it, the lead frames used in this packaging technology are basically 2-row and 5-row. From the perspective of packaging cost, the number of frame rows is low, the material utilization rat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/50
Inventor 高睿陈志祥何乃辉魏存晶
Owner 广东韶华科技有限公司
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