Curing Agents for Low Emission Epoxy Products
A technology of epoxy resin and curing agent, which is used in the field of coatings, coverings and paints, and can solve the problems of complexity and high preparation costs
Inactive Publication Date: 2017-12-29
SIKA TECH AG
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
The preparation of the adducts is costly and complicated due to the use of a large excess of amine and subsequent removal by distillation
Method used
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[0160] The following list is intended to further illustrate the embodiments of the present invention. Of course, the invention is not limited to the described exemplary embodiments.
[0161] "AHEW" stands for amine hydrogen equivalent weight.
[0162]"EEW" stands for epoxide equivalent weight.
[0163] "MGC" stands for "Mitsubishi Gas Chemical".
[0164] "sek.Diamin" stands for "secondary diamine".
[0165] 1. Description of the measurement method
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Abstract
The present invention relates to a curing agent for epoxy resins comprising at least one adduct of a primary diamine and an aromatic monoepoxide, at least one primary diamine and at least one primary diamine-free Secondary diamines with amino groups and hydroxyl groups. The curing agent is low-viscosity and also cures rapidly together with the epoxy resin to a film of high hardness and very low brittleness under wet and cold conditions without fogging effect. The curing agent is particularly suitable for low emission room temperature curing coatings.
Description
technical field [0001] The present invention relates to the field of curing agents for epoxy resins, epoxy resin products and their use, in particular as coatings, coverings and varnishes. Background technique [0002] Amine-containing mixtures based on epoxide-amine adducts are commonly used as curing agents for room temperature curing epoxy resin products. Most of them are too viscous without thinner, especially for paint applications. As diluents, in particular benzyl alcohols, diols or alkylphenols are used, which are comparatively low-odor and are very compatible with epoxy resins. The diluent is non-reactive with respect to the epoxy resin at room temperature and does not become incorporated into the resin matrix during curing. However, there is currently an increasing demand for low-emission products which, after curing, have a low content of substances which can be released by evaporation or diffusion processes. In the case of low-emission epoxy resin products, di...
Claims
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IPC IPC(8): C08G59/18C08G59/56C08L63/00C09D163/00
CPCC08G59/56C08G59/184C08G59/223C08G2650/50C09D163/00
Inventor E·卡瑟米A·克拉默U·斯塔德尔曼U·布尔克哈特
Owner SIKA TECH AG



