Spectrum detector based on high electron mobility transistor and preparation method thereof
A high electron mobility, spectral detector technology, applied in semiconductor devices, circuits, electrical components, etc., can solve the problems of lack of lattice matching substrates, high cost and volume, film defects, etc., to achieve cost and volume reduction , high sensitivity detection, the effect of improved sensitivity
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[0037] Corresponding to the above spectral detector, the present invention also discloses a preparation method of a spectral detector based on a high electron mobility transistor, such as figure 2 As shown, the method includes the following steps:
[0038] S1. Prepare epitaxial wafers, source regions, drain regions and gate metal films of high electron mobility transistors;
[0039] S2. Prepare a photocathode thin film on the gate metal thin film.
[0040] Step S1 specifically includes the following steps:
[0041] S11. Prepare an epitaxial wafer including a first semiconductor layer and a second semiconductor layer, wherein the second semiconductor layer covers the upper surface of the first semiconductor layer;
[0042] S12. Prepare a source region and a drain region on both sides of the first semiconductor layer, the source region and the drain region both penetrate the second semiconductor layer, and both the source region and the drain region extend into the first semi...
Embodiment
[0045] Taking GaN / AlGaN HEMT (High Electron Mobility Transistor) as an example, the gate of the HEMT device is a Schottky gate, and the cesium iodide photocathode thin film is used as the light absorption layer. The detection of the visible light spectrum can be realized. In order to make the gate metal and the photocathode material have better adhesion, a layer of titanium Ti metal is sputtered between the gate metal film and the photocathode film, the specific steps are as follows:
[0046]1. First, an epitaxial wafer (first semiconductor layer and second semiconductor layer) with a GaN / AlGaN structure is prepared by a conventional metal organic chemical vapor deposition (MOCVD) process;
[0047] 2. Use the magnetron sputtering system to prepare source-drain electrodes with ohmic contacts;
[0048] 3. Using magnetron sputtering system to prepare gate metal film;
[0049] 4. Prepare Ti metal layer by using magnetron sputtering system;
[0050] 5. Evaporate a layer of cesiu...
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