Directional porous SiC and diamond reinforced Al base composite material and preparation method thereof

A diamond-reinforced, composite material technology, applied in the field of high thermal conductivity metal matrix composite materials and preparation for electronic packaging, to achieve the effects of easy realization, simple preparation process, and reduced thermal stress

Active Publication Date: 2015-10-07
咸阳瞪羚谷新材料科技有限公司
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However, up to now, there is no public literature report on Al-based composites reinfor

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  • Directional porous SiC and diamond reinforced Al base composite material and preparation method thereof
  • Directional porous SiC and diamond reinforced Al base composite material and preparation method thereof
  • Directional porous SiC and diamond reinforced Al base composite material and preparation method thereof

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Embodiment Construction

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] A hybrid reinforced Al-based composite material of oriented porous SiC ceramics and diamond particles, in terms of volume fraction, composed of a SiC ceramic phase, a diamond particle phase and an Al metal phase composed of Table 1, wherein the SiC ceramic phase is a three-dimensional network porous Skeleton structure, these pores are roughly arranged in one direction and communicate with each other to form directional pores, which are loosely filled by diamond particles, and the Al metal phase melts into the directional pores of porous SiC ceramics filled with diamond particles, and is completely densely filled . (see figure 2 ).

[0032] The preparation process of the above-mentioned oriented porous SiC ceramics and diamond particle hybrid reinforced Al-based composite material includes the following steps:

[0033] The f...

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Abstract

The invention discloses a directional porous SiC and diamond reinforced Al base composite material and a preparation method thereof. The composite material is composed of a SiC ceramic phase, a diamond particle phase and a Al metal phase. The preparation method of the composite material comprises the following steps: 1, preparing directional porous SiC ceramic; 2, coating a WC coating layer on the surface of diamond particles; 3, filling directional porous apertures of the porous SiC ceramic with the diamond particles; and 4, allowing Al to spontaneously infiltrate into the directional apertures filled with the diamond particles. The directional porous SiC and diamond reinforced Al base composite material prepared through adopting the method has very high heat conductivity in a directional aperture direction, and can timely transmit heat generated by a semiconductor to heat sink in order to dissipate the heat; and the composite material has a heat expansion coefficient matched with a packaging substrate in a direction vertical to the directional aperture direction (the plane of a semiconductor device), so the heat stress between a packaging material and the semiconductor is reduced, the working efficiency of the semiconductor is improved, and the service life of the semiconductor is prolonged.

Description

technical field [0001] The invention relates to functional materials and their preparation, in particular to a high thermal conductivity metal matrix composite material for electronic packaging and its preparation method. Background technique [0002] In recent years, with the advancement of electronic chips towards high integration, miniaturization and light weight, the research of aluminum matrix composite materials for electronic packaging has made great progress. At present, there are many Al-based composite materials studied, and their composite configuration is mainly single-phase reinforced, including: (1) 0-dimensional particle reinforcement, such as SiC particle reinforcement (patent application number 201410755066.1 "a high-performance electronic Preparation method of SiC / Al composite material for packaging"), diamond particle reinforcement (patent application number 200910055065.5 "Diamond-reinforced metal matrix composite material for electronic packaging and its...

Claims

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Application Information

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IPC IPC(8): C22C1/08C22C21/00C22C32/00C22C30/00C22C29/06
Inventor 史忠旗张阔杨少辉夏鸿雁王继平乔冠军王红洁杨建锋
Owner 咸阳瞪羚谷新材料科技有限公司
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