Optical module

Abstract

The invention provides an optical module, and solves a problem of heat radiation of a drive chip covered by a lens assembly. The optical module comprises a circuit board, the lens assembly, a laser device or a detector, the drive chip, a heat-radiating fin which is surface-mounted on the upper surface of the drive chip, and a heat-conducting layer which is laid on the circuit board. The laser device, the detector and the drive chip are surface-mounted on the circuit board and are covered by the lens assembly. The heat-radiating fin is downwardly bent from the upper surface of the drive chip and then connected with the heat-conducting layer. Partial or the entire heat-conducting layer is laid on the part of the circuit board without coverage of the lens assembly. The heat-radiating fin is surface-mounted on the upper surface of the drive chip in the coverage space of the lens assembly, and the heat-radiating fin and the heat-conducting layer are connected to form a heat radiation path so that heat radiated by the drive chip in the coverage space of the lens assembly is conducted out of the space and thus the technical effect of heat radiation is realized.

Description

technical field [0001] The invention relates to the technical field of optical fiber communication, in particular to an optical module. Background technique [0002] In the field of optical fiber communication technology, the optical module converts the electrical signal into an optical signal before sending it, and converts the received optical signal into an electrical signal, which plays the role of photoelectric conversion. Typically includes circuit boards, chips, photodetectors, lasers, lens assemblies and heat sinks. [0003] Such as figure 1 As shown, in the optical communication COB (Chip On Broad, that is, the bare chip is glued on the interconnection substrate with conductive or non-conductive adhesive, and then wire bonded to achieve electrical connection) packaging technology, the driver chip 2 is directly mounted On the printed circuit board 1 , it is used to drive the laser 3 or the detector 4 ; a lens assembly 5 is placed above the driving chip 2 . For rel...

AI Technical Summary

Problems solved by technology

[0005] For high-speed, high-power driver chips, the high-speed signal will be lost in the gold wire, and the flip chip under the driver chip 2 (flip chip: deposit tin-lead balls on the input and output ends of the chip, due to the input and output The distribution of the leads and the entire surface of the chip, then all the tin-lead balls are distributed on the entire lower surface of the chip) to connect the pins of the driver chip with the lines on the printed circuit board to achieve communication. In this case, although it is solved The problem of signal transmission loss, but because the driver chip 2 covered by the lens assembly is a tin-lead ball for signal transmission, it is no longer possible to use the method of laying copper under the driver chip to dissipate the heat generated by the driver chip

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