Thermally-driven RF MEMS switch

A thermally driven and switching technology, applied in piezoelectric devices/electrostrictive devices, waveguide devices, electrical components, etc., can solve problems such as longitudinal dimensional error stress, performance degradation, switching consistency degradation, etc., to reduce process errors , improve reliability, low cost effect

Inactive Publication Date: 2015-10-21
SOUTHEAST UNIV
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  • Abstract
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  • Application Information

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Problems solved by technology

At present, the research on RF MEMS switches based on LCP substrates at home and abroad is mainly electrostatically driven switches, and the electrostatically driven switches with double-ended fixed beam and cantilever beam structures are all longitudinal switches, which are prone to longitudinal dimension differences in the LCP substrate processing technology. Problems such as errors and introduced stress lead to deterioration of switch consistency and performance degradation. In addition, because LCP is a flexible material, it will cause reliability and drive problems in longitudinal RF MEMS switches in the event of bending.

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  • Thermally-driven RF MEMS switch

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with the accompanying drawings.

[0016] see figure 1 , the present invention provides a thermally driven RF MEMS switch, the thermally driven RF MEMS switch includes a substrate, a V-beam locking thermal driver 1, a V-beam unlocking thermal driver 2, a locking switch structure, and coplanar waveguide grounds 6a, 6b , 6c, 6d and the bonding wires 5a, 5b between the coplanar waveguide ground; wherein the latch switch structure is arranged on the substrate, and the V-shaped beam latch thermal driver 1 includes the driving rod 1a, the V-shaped beam 1b and the anchor area 1c, 1d; V-beam unlock thermal driver 2 includes drive rod 2a, V-beam 2b and anchor area 2c, 2d; latch switch structure includes cantilever beam 3a, 4a, cantilever beam anchor area 3b, 4b, and cantilever beam and drive rod Between the air gap 3c, 4c; at the tail end of the cantilever beam 3a, 4a are provided with locking hooks that coope...

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Abstract

The invention provides a thermally-driven RF MEMS switch which comprises a substrate. A buckling switch structure is arranged on the substrate. The buckling switch structure comprises cantilever beams (3a, 4a). The tail ends of the cantilever beams (3a, 4a) are provided with mutually cooperating locking hooks. The side surface of the cantilever beam (3a) is provided with a V-shaped beam buckling thermal driver (1) used for driving the cantilever beam (3a). The side surface of the cantilever beam (4a) is provided with a V-shaped beam unlocking thermal driver (2) used for driving the cantilever beam (4a). A horizontal thermally-driven switch is adopted in the invention. The technical errors of an LCP substrate are reduced. The switch reliability, consistency and performance stability when the substrate is bent are improved.

Description

technical field [0001] The invention is a heat-driven RF MEMS switch realized by using LCP material technology, and belongs to the technical field of microelectronic devices. Background technique [0002] In the research of microwave technology, RF MEMS devices have attracted extensive attention in the field of radio frequency due to their excellent microwave performance, especially RF MEMS switches, because of their low insertion loss, high isolation, high linearity and low power consumption, Become the preferred device to replace traditional RF switches. In microwave systems, switches have a large number of applications, which are used to turn on and off microwave signals. For example, the reconfigurability of radio frequency devices is generally based on radio frequency switches. [0003] The vast majority of RF MEMS switches are manufactured on silicon substrates or gallium arsenide substrates, but due to the poor compatibility between the processing technology of silic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/12H01P1/15B81B3/00
Inventor 韩磊高晓峰
Owner SOUTHEAST UNIV
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