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Preparation method of enhanced silicone heat conducting sheet

A heat-conducting sheet and silicone technology, which is applied in the field of preparation of silicone heat-conducting sheets, can solve the problems of limited adhesive force improvement, achieve the effect of increasing interlayer bonding strength, improving durability and reliability

Active Publication Date: 2018-04-17
惠州市安品新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, in silica gel sheets and other silicone thermally conductive composite sheets, a coupling agent or an adhesive is usually applied to the substrate layer to improve the bonding strength between the silica gel layer and the reinforced substrate, and prevent the silica gel layer from being bonded to the substrate. The layers are separated to improve the reliability and durability of the silicone sheet in the application, but this method has limited improvement in the adhesion between different material layers

Method used

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  • Preparation method of enhanced silicone heat conducting sheet
  • Preparation method of enhanced silicone heat conducting sheet
  • Preparation method of enhanced silicone heat conducting sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] In the adhesion promoter of this embodiment, the hydrogen-containing organopolysiloxane is methyl hydrogen-containing silicone oil, the viscosity at 25°C is 700mPa·s, the hydrogen content is 0.3% (mass), and the hydroxyl-containing organopolysiloxane It is α, ω-dihydroxy polydimethylsiloxane, the mass percentage of hydroxyl group is 0.6%, and the viscosity at 25°C is 1000mPa·s.

[0044] In the silicone rubber composition, the organopolysiloxane containing vinyl is α, ω-divinylpolydimethylsiloxane, the viscosity at 25°C is 100mPa·s, and the mass percentage of vinyl is 2.5%. ; The thermally conductive filler is alumina with an average particle size of 30 μm; the crosslinking agent is methyl hydrogen silicone oil, the viscosity at 25° C. is 100 mPa·s, the hydrogen content is 0.2% (mass), and the platinum catalyst is a platinum catalyst.

[0045] The preparation method of the enhanced silicone heat conducting sheet is as follows:

[0046] A mix the methyl hydrogen-containi...

Embodiment 2

[0050] In the adhesion promoter of this embodiment, the hydrogen-containing organopolysiloxane is methyl hydrogen-containing silicone oil, the viscosity at 25°C is 20 mPa·s, the hydrogen content is 0.8% (by mass), and the hydroxyl-containing organopolysiloxane It is α, ω-dihydroxy polydimethylsiloxane, the mass percentage of hydroxyl group is 2%, and the viscosity at 25°C is 300mPa·s.

[0051] In the silicone rubber composition, the organopolysiloxane containing vinyl is α, ω-divinylpolydimethylsiloxane, the viscosity at 25°C is 40000mPa·s, and the mass percentage of vinyl is 0.2%. The thermally conductive filler is obtained by mixing alumina with an average particle size of 3 μm and alumina with an average particle size of 50 μm at a mass ratio of 2:4; the crosslinking agent is methyl hydrogen-containing silicone oil, with a viscosity of 1000 mPa·s at 25 °C and contains hydrogen The amount is 0.03% (mass), and the platinum catalyst is a platinum catalyst.

[0052] The prepar...

Embodiment 3

[0057] In the adhesion promoter of this embodiment, the hydrogen-containing organopolysiloxane is methyl hydrogen-containing silicone oil, the viscosity at 25°C is 200mPa·s, the hydrogen content is 0.4% (mass), and the vinyl-containing organopolysiloxane The alkane is a copolymer of trimethylsiloxy-terminated dimethylsiloxane and methylvinylsiloxane, the mass percentage of vinyl is 0.9%, and the viscosity at 25°C is 300mPa·s.

[0058] In the silicone rubber composition, the organopolysiloxane containing vinyl is α, ω-divinylpolydimethylsiloxane, the viscosity at 25°C is 1000mPa·s, and the mass percentage of vinyl is 0.5%. The thermally conductive filler is aluminum nitride with an average particle size of 20 μm; the crosslinking agent is methyl hydrogen silicone oil, the viscosity at 25° C. is 300 mPa·s, the hydrogen content is 0.07% (mass), and the platinum catalyst is a platinum catalyst.

[0059] The preparation method of the enhanced silicone heat conducting sheet is as fo...

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Abstract

The invention discloses a preparation method of an enhanced organosilicon heat-conducting sheet. An adhesion promoter is coated on a glass cloth to obtain a base material layer. The adhesion promoter includes a hydrogen-containing organopolysiloxane, and a The components of the silicone rubber composition of vinyl organopolysiloxane, cross-linking agent, thermal conductive filler and platinum catalyst are mixed, and then laminated and compounded with the substrate layer, and a reinforced silicone thermal conductive sheet is obtained after curing. The preparation method of the present invention effectively improves the interlayer bonding force between the silicone rubber composition and the glass cloth, and improves the durability and reliability of the sheet by pre-processing the glass cloth reinforcing material.

Description

technical field [0001] The invention belongs to the technical field of organic silicon materials, and relates to a preparation method of an enhanced organic silicon heat conducting sheet. technical background [0002] Organosilicon materials have excellent properties such as high and low temperature resistance, electrical insulation, oxidation resistance, weather resistance, flame retardant, and corrosion resistance. They are widely used in the chemical industry, especially in the field of thermal conductivity technology. Thermal interface materials containing silicone It is the main type of thermal conductive material. Silicone thermal interface materials are mainly used in electrical equipment between heat-generating parts and heat-dissipating parts to perform heat conduction, sealing and insulation functions. The product forms include silicone grease and silicone sheets, of which silicone sheets generally include silicone layers and substrates containing thermally conduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/00C08L83/07C08K3/22C08K3/28D06M15/643
Inventor 张耀湘李云覃剑
Owner 惠州市安品新材料有限公司
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