Laser drilling and cutting system for semiconductor material

Abstract

The invention discloses a laser drilling and cutting system for a semiconductor material. The laser drilling and cutting system comprises a laser path subsystem, a motion platform subsystem, a vision positioning and detection subsystem and an industrial personal computer. The laser path subsystem is composed of a reflector, a laser unit arranged beside the reflector and a focusing mirror arranged below the reflector. The vision positioning and detection subsystem is composed of a displayer, an imaging lens cone, a camera, a focusing mirror and a lighting lamp. The imaging lens cone and the camera are located above the reflector on the same vertical line, the focusing mirror is located below the reflector, and the lighting lamp is arranged beside the focusing mirror. The camera is connected with the reflector through the imaging lens cone. The reflector can reflect lasers and also can conduct light transmittance of an imaging light source. Laser synchronous drilling, machine vision positioning secondary re-drilling, drilling form and position error detection, laser cutting and other functions are integrated and achieved for the semiconductor material in the motion process, and through hole and blind hole drilling, laser cutting, vision detection and other functions can be achieved for the semiconductor material in the motion process.

Description

technical field [0001] The invention belongs to the technical field of semiconductor material processing equipment, and in particular relates to a laser drilling and cutting equipment for semiconductor materials. Background technique [0002] With the advent of the information age, industries such as electronic information, communications, semiconductor integrated circuits, and high-power power electronics have developed rapidly, semiconductor materials have been widely used, and the demand is increasing. The through holes and blind holes of semiconductor materials are manufactured into chips. One of the core key processes of manufacturing, wafer manufacturing technology and processes require higher and higher manufacturing efficiency and positional accuracy for through holes and blinds. [0003] The traditional EDM technology has technical limitations such as extremely low efficiency in actual production, and the processed material needs to have good electrical conductivity...

AI Technical Summary

Problems solved by technology

[0003] The traditional EDM technology has technical limitations such as extremely low efficiency in actual production, and the processed material needs to have good electrical conductivity, which cannot improve production efficiency.

The method of chemical etching cannot solve the problem of the manufacture of micropores with a diameter of less than 50 microns and a depth of more than 500 microns.

Therefore, the production of through holes and blind holes in wafer manufacturing is greatly limited.

Therefore, these electric spark perforation and chemical corrosion openings cannot completely solve the above problems through the optimization of the process itself. It is urgent to adopt new processing methods to solve the bottleneck of semiconductor material micropore manufacturing. and efficient micro-hole processing methods to replace traditional methods

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