Ultra-precise oblique angle turning method for machining mirror surface of soft and brittle material
A mirror processing and ultra-precision technology, which is applied in the field of precision and ultra-precision cutting, can solve the problems of sub-surface damage, surface roughness, material surface cracking and cracking, etc., to improve the quality of the processed surface, reduce the depth of damage, and improve chip removal and the effect of cooling conditions
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specific Embodiment approach 1
[0019] Specific implementation mode one: combine figure 1 , this embodiment is an ultra-precision bevel turning method for mirror surface processing of soft and brittle materials, which is specifically completed according to the following steps:
[0020] 1. Preliminary preparation: Strictly control the ambient temperature, humidity and cleanliness around the ultra-precision machining machine tool. The temperature is controlled at 23°C ± 0.1°C, the humidity is controlled at 45% ± 5%, and the cleanliness is above 1000 grades;
[0021] 2. Machine tool warm-up: start the ultra-precision machining machine tool, and wait until the performance of the ultra-precision machining machine tool is stable;
[0022] 3. Polishing pretreatment: the polycrystalline ZnS material is subjected to polishing pretreatment, and the polycrystalline ZnS material after polishing pretreatment is obtained;
[0023]4. Installation: Install the pre-polished polycrystalline ZnS material through the high-prec...
specific Embodiment approach 2
[0038] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the radius of the cutting blunt circle of the natural diamond tool I described in step 4 should be less than 30 nm. Others are the same as the first embodiment.
[0039] The cutting edge consistency of the natural diamond cutter I described in this embodiment is better.
specific Embodiment approach 3
[0040] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the radius of the cutting blunt circle of the natural diamond tool II described in step 7 should be less than 30 nm. Others are the same as those in Embodiment 1 or 2.
[0041] The cutting edge consistency of the natural diamond cutter II described in this embodiment is better.
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