A kind of ceramic resin composite bond and diamond grinding wheel and its preparation process

Abstract

The invention discloses a ceramic resin composite bond, a diamond grinding wheel and a preparation process thereof. The ceramic resin composite bond is composed of the following raw materials in weight percentage: 30-70% of the ceramic bond, 30-70% of the resin bond; 30-70% of the ceramic bond The agent is composed of the following raw materials in weight percentage: silicon dioxide SiO2 35-45%, aluminum oxide Al2O3 20-35%, calcium oxide CaO 15-25%, barium sulfate BaSO4 10-20%; the resin binder is phenolic resin. The composite bond diamond grinding wheel is composed of a grinding wheel base and an abrasive layer arranged on the grinding wheel base. The abrasive layer is made of diamond abrasive and the above-mentioned ceramic resin composite bond. By setting the process parameters of cold pressing and sintering during the preparation of the abrasive layer , the obtained diamond grinding wheel has high strength and good self-sharpening, and does not need to be trimmed during the grinding process of the diamond composite sheet, so that the processed diamond composite sheet has high dimensional accuracy and excellent surface quality.

Description

technical field [0001] The invention relates to the technical field of grinding wheels for diamond composite sheet grinding, in particular to a ceramic resin composite binder, a diamond grinding wheel and a preparation process thereof. Background technique [0002] Diamond composite sheet is sintered with diamond micropowder and cemented carbide substrate under ultra-high pressure and high temperature conditions. It not only has the high hardness, high wear resistance and thermal conductivity of diamond, but also has the strength and impact toughness of cemented carbide. , widely used in the manufacture of cutting tools, drilling bits and other wear-resistant tools. Before use, the diamond composite sheet needs to be processed by cylindrical processing, plane processing, chamfering and other processes. At present, centerless grinding is mostly used for cylindrical processing, and resin bonded diamond grinding wheels and vitrified bonded diamonds are used for plane processing...

AI Technical Summary

Problems solved by technology

[0003] The vitrified bond diamond grinding wheel has high strength, wear resistance and long service life, but because the diamond composite sheet also has high hardness, it is relatively poor in self-sharpening during grinding; More heat will be generated during the grinding process, and the temperature of most of the resins selected is only 200~800°C, so the high temperature resistance of the resin bonded diamond grinding wheel is poor, but its self-sharpening is good, the grinding is sharp, and Good heat dissipation effect, not easy to burn the knife

[0004] Ceramic bond and resin bond diamond grinding wheels need to be trimmed before centerless grinding, surface grinding and chamfering of diamond composite sheets. Vitrified bond diamond grinding wheels are generally dressed with resin bond grinding wheels, and resin bond diamond grinding wheels Generally, green silicon carbide grinding wheel or soft iron is used for dressing. The dressing process is cumbersome, which reduces the production efficiency to a certain extent, and the poor dressing effect will have a negative impact on the dimensional accuracy and surface quality of the diamond composite sheet during use. Even lead to the waste of diamond compact

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