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Photocuring-thermocuring composite ink, application and circuit board containing photocuring-thermocuring composite ink

A composition and light-curing technology, applied in the direction of ink, application, household appliances, etc.

Active Publication Date: 2015-11-25
深圳市容大感光科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the Chinese patent application number: 201310723572.8 announced the epoxy resin containing two or more epoxy groups in a molecule of partial (meth) propionate esterification. Although this composition meets the requirements of EU REACH regulations, the developing Manufacturability and heat resistance of cured coatings need to be improved

Method used

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  • Photocuring-thermocuring composite ink, application and circuit board containing photocuring-thermocuring composite ink
  • Photocuring-thermocuring composite ink, application and circuit board containing photocuring-thermocuring composite ink
  • Photocuring-thermocuring composite ink, application and circuit board containing photocuring-thermocuring composite ink

Examples

Experimental program
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Effect test

Embodiment 1

[0078] According to the material ratio listed in Example 1 of Table 1, accurately weigh various materials into the container, use a high-speed disperser, stir and disperse at a speed of 500 rpm for 15 minutes, and then grind the composition with three rollers Machine milled three times to make the composition finer than 15 microns. The viscosity of the above composition was determined to be 200 dPa.s / 25°C.

[0079] The developability, solder heat resistance, adhesion, hardness, solvent resistance, acid resistance, and alkali resistance of the composition were evaluated.

[0080] Developability: Using the process of screen printing, the composition ink of Example 1 was coated on three clean circuit board substrates with conductive lines made through 43T nylon mesh, marked as B11 / B12 / B13, respectively. Make the dry film thickness of the coating 25-30 microns, in a constant temperature oven at a temperature of 75 ℃, dry B11 for 60 minutes, B12 for 70 minutes, and B13 for 80 minu...

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Abstract

The invention provides photocuring-thermocuring composite ink. The ink comprises the following components: A, 10 to 60% of photopolymerization resin with an molecule containing carboxyl and an unsaturated double bond; B, 2 to 20% of a photopolymerization unsaturated double-bond monomer; C, 0.5 to 20% of hydantoin epoxy resin; D, 2 to 20% of epoxy resin; E, 0.1 to 5% of an epoxy curing accelerator; F, 0.1 to 15% of a photopolymerization initiator; G, 10 to 70% of a filler; H, 0 to 10% of pigment; I, 0.1 to 5% of a defoaming agent; meanwhile, the ink also comprises a leveling agent, an antioxidant, an adhesion promotor, a thixotropic agent and a solvent. The composite ink is applied in printing an insulation solder protectant of a circuit and has good performcances like solder heat resistance, developability, adhesiveness, hardness, alkali resistance, acid resistance, solvent resistance, etc.

Description

technical field [0001] The present invention relates to a composition ink, its use for printed circuit boards and a circuit board comprising an insulating heat-resistant protective solder resist coating formed from the composition ink. Background technique [0002] Due to the requirements of lightness, thinness, thinness, durability and reliability of electronic products, in recent years, light-curable and heat-curable composition inks have been widely used in the manufacture of printed circuit boards. The photo-curable heat-curable composition ink can be coated on the circuit board substrate by screen printing, roller coating, electrostatic spraying, air spraying, etc., and then dried at 70-80°C in a well-ventilated condition. After contact or non-contact Selective light exposure. Then clean the unirradiated part with a dilute alkaline aqueous solution. Common dilute alkaline aqueous solutions that can be used are aqueous solutions of sodium carbonate, sodium hydroxide, po...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/102C09D11/03H05K1/02C08G59/17
Inventor 刘启升黄滨杨遇春
Owner 深圳市容大感光科技股份有限公司
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