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A kind of light-curable heat-curable composition ink, application and circuit board containing it

A composition, light-curing technology, used in inks, applications, household appliances, etc.

Active Publication Date: 2018-07-27
深圳市容大感光科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the Chinese patent application number: 201310723572.8 announced the epoxy resin containing two or more epoxy groups in a molecule of partial (meth) propionate esterification. Although this composition meets the requirements of EU REACH regulations, the developing Manufacturability and heat resistance of cured coatings need to be improved

Method used

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  • A kind of light-curable heat-curable composition ink, application and circuit board containing it
  • A kind of light-curable heat-curable composition ink, application and circuit board containing it
  • A kind of light-curable heat-curable composition ink, application and circuit board containing it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] According to the material ratio listed in Table 1, Example 1, accurately weigh various materials into the container, use a high-speed disperser, with a speed of 500 revolutions per minute, stir and disperse for 15 minutes, and then grind the composition with three rolls Machine mill three times to make the composition finer than 15 microns. The viscosity of the above composition was measured to be 200dPa.s / 25°C.

[0079] The composition was evaluated for developability, solder heat resistance, adhesion, hardness, solvent resistance, acid resistance, and alkali resistance.

[0080] Developability: using the screen printing process, the ink of the composition of Example 1 is coated on three clean circuit board substrates with conductive lines through a 43T nylon screen, which are respectively marked as B11 / B12 / B13, Make the dry film thickness of the coating 25-30 microns, in a constant temperature oven at 75°C, dry B11 for 60 minutes, B12 for 70 minutes, and B13 for 80 m...

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Abstract

A light-curable heat-curable resin composition ink, which comprises: A molecule contains 10-60% of a photopolymerizable resin containing carboxyl groups and unsaturated double bonds, B photopolymerizable unsaturated double-bond monomer 2-20%, C hydantoin Epoxy resin 0.5‑20%, D epoxy resin 2‑20%, E epoxy curing accelerator 0.1‑5%, F photopolymerization initiator 0.1‑15%, G filler 10‑70%, H pigment 0‑10 %, I defoamer 0.1-5%, also can comprise leveling agent, antioxidant, adhesion promoter, thixotropic agent, solvent. The composition ink is applied to the insulating solder protection of printed circuits, and has good solder heat resistance, developability, adhesion, hardness, alkali resistance, acid resistance, solvent resistance and other properties.

Description

technical field [0001] The present invention relates to a composition ink, its use for printed circuit boards and a circuit board comprising an insulating heat-resistant protective solder resist coating formed from the composition ink. Background technique [0002] Due to the requirements of lightness, thinness, thinness, durability and reliability of electronic products, in recent years, light-curable and heat-curable composition inks have been widely used in the manufacture of printed circuit boards. The photo-curable heat-curable composition ink can be coated on the circuit board substrate by screen printing, roller coating, electrostatic spraying, air spraying, etc., and then dried at 70-80°C in a well-ventilated condition. After contact or non-contact Selective light exposure. Then clean the unirradiated part with a dilute alkaline aqueous solution. Common dilute alkaline aqueous solutions that can be used are aqueous solutions of sodium carbonate, sodium hydroxide, po...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101C09D11/102C09D11/03H05K1/02C08G59/17
Inventor 刘启升黄滨杨遇春
Owner 深圳市容大感光科技股份有限公司
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