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Packaging structure and packaging method

A technology of packaging structure and packaging method, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of lead bending fatigue, fracture and debonding, inconsistent tail wires, etc., to improve stability and improve Effects of efficiency, small package height

Active Publication Date: 2015-11-25
HEFEI SMAT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The prior art wire bonding has problems such as pad out pit, inconsistent tail wire, lead bending fatigue, vibration fatigue, fracture and debonding

Method used

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  • Packaging structure and packaging method
  • Packaging structure and packaging method
  • Packaging structure and packaging method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0045] figure 1 A schematic structural diagram of the packaging structure of the first embodiment of the present invention is shown. The package structure 10 includes: a package substrate 210, a die 110, an adhesive layer 211, a first encapsulation body 311, a second encapsulation body 312, an interconnection structure, and a rewiring structure.

[0046] The packaging substrate 210 may include semiconductor materials (such as silicon, germanium, indium antimonide, gallium arsenide, indium arsenide, gallium nitride, etc.), insulating materials (epoxy resin, polyester glass, silicon dioxide, polytetrafluoroethylene, etc.) , Glass, ceramics, etc.) or a combination thereof. The packaging substrate 210 includes opposite first and second surfaces.

[0047] The die 110 includes opposite active and back surfaces. The device layer of the die 110 is located on the active side, and the device layer includes transistors and other devices such as resistors, capacitors, and inductors. Above t...

no. 2 example

[0055] figure 2 The structure diagram of the package structure of the second embodiment of the present invention is shown. The package structure 20 includes: a package substrate 220, a die 120, an adhesive layer 221, a first encapsulation body 321, an interconnection structure, a second encapsulation body 322, and a rewiring structure. The interconnection structure includes a patterned metal layer 421 and a metal layer 422; the rewiring structure includes a metal layer 522 and a solderable layer 521.

[0056] The packaging substrate 220 may include semiconductor materials (such as silicon, germanium, indium antimonide, gallium arsenide, indium arsenide, gallium nitride, etc.), insulating materials (epoxy, polyester glass, silicon dioxide, polytetrafluoroethylene, etc.) , Glass, ceramics, etc.) or a combination thereof. The packaging substrate 220 includes opposite first and second surfaces.

[0057] The die 120 includes opposing active and back surfaces. The device layer of the...

no. 3 example

[0065] image 3 A structural diagram of the package structure of the third embodiment of the present invention is shown. The packaging structure 30 includes a packaging substrate 230, a die 130, an adhesive layer 231, a back metal layer 535, a first encapsulation body 331, an interconnection structure, a second encapsulation body 332, a through channel, and a redistribution structure. The interconnection structure includes a patterned metal layer 431 and a metal layer 432; the rewiring structure includes a patterned metal layer 531, a metal layer 532, a metal layer 533, and a solderable layer 534.

[0066] The packaging substrate 230 may include semiconductor materials (such as silicon, germanium, indium antimonide, gallium arsenide, indium arsenide, gallium nitride, etc.), insulating materials (epoxy resin, polyester glass, silicon dioxide, polytetrafluoroethylene, etc.) , Glass, ceramics, etc.) or a combination thereof. The packaging substrate 230 includes opposite first and s...

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PUM

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Abstract

The invention discloses a packaging structure, which comprises a substrate, a pipe core, a first packaging body, an interconnection structure, a second packaging body and a rewiring structure, wherein the substrate comprises opposite first surface and second surface; the pipe core comprises opposite active surface and back surface; the pipe core is arranged on the first surface of the substrate; the back surface of the pipe core is adjacent to the first surface of the substrate; a bonding pad is arranged on the active surface of the pipe core; the first packaging body covers the pipe core; the interconnection structure penetrates through the first packaging body and is electrically connected with the bonding pad; the second packaging body covers the interconnection structure; and the rewiring structure is electrically connected with the interconnection structure and provides external electrical connection.

Description

Technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging structure and a packaging method. Background technique [0002] When manufacturing integrated circuits, the chips are usually packaged before integration with other electronic assemblies. This package usually includes sealing the chip in a material and providing electrical contacts on the outside of the package to provide an interface to the chip. Chip packaging can provide electrical connections from the chip to the motherboard of electrical or electronic products, protection against pollutants, provide mechanical support, heat dissipation, and reduce thermomechanical strain. [0003] The connection between the internal chip and external pins of the semiconductor package plays an important role in establishing the input / output between the chip and the outside world, and is a key step in the packaging process. The prior art connection method includes wire bonding. W...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/48H01L21/60H01L21/56
CPCH01L2224/04105H01L2224/24226H01L2224/32225H01L2224/73267H01L23/3121H01L24/19H01L24/20H01L24/24H01L24/82H01L23/3677H01L24/32H01L24/73H01L24/92H01L2224/82039H01L2224/92244H01L2924/19042H01L2924/19043H01L2224/82031H01L23/49827H01L23/5389H01L21/56
Inventor 谭小春
Owner HEFEI SMAT TECH CO LTD