Organosilicon sealant for LED (light-emitting diode) packaging
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A technology of sealant and silicone, applied in the direction of electrical components, circuits, semiconductor devices, etc.
Inactive Publication Date: 2015-12-02
BLUESTAR CHENGDU NEW MATERIALS
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Abstract
Description
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Problems solved by technology
[0005] The invention aims to solve the problem of organic silicon materials used in LED packaging in the prior art, and provides
Method used
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Examples
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Embodiment 1
[0027] A silicone sealant for LED potting, comprising the following raw materials in parts by weight:
[0028] A component
[0029] Divinyl Dimethicone silicone resin 15 parts
[0030] Platinum catalyst 2 parts
[0031] B component
[0032] Divinyl polydimethylsiloxane silicone resin 50 parts
[0033] 50 parts of methyl hydrogen polysiloxane
[0034] Reaction Inhibitor 2 parts
[0035] Fumed white carbon black 30 parts
[0036] Additive KH-5602 parts
[0037] TiO 2 20 servings.
Embodiment 2
[0039] A silicone sealant for LED potting, comprising the following raw materials in parts by weight:
[0040] A component
[0041] Divinyl Dimethicone silicone resin 25 parts
[0042] Platinum catalyst 6 parts
[0043] B component
[0044] Divinyl polydimethylsiloxane silicone resin 58 parts
[0045] 58 parts of methyl hydrogen polysiloxane
[0046] Reaction Inhibitor 8 parts
[0047] Fumed white carbon black 40 parts
[0048] Additive KH-56010 parts
[0049] TiO 2 25 servings.
Embodiment 3
[0051] A silicone sealant for LED potting, comprising the following raw materials in parts by weight:
[0052] A component
[0053] Divinyl Dimethicone silicone resin 20 parts
[0054] Platinum catalyst 4 parts
[0055] B component
[0056] Divinyl polydimethylsiloxane silicone resin 55 parts
[0057] 55 parts of methyl hydrogen polysiloxane
[0058] Reaction Inhibitor 5 parts
[0059] Fumed white carbon black 35 parts
[0060] Additive KH-5606 parts
[0061] TiO 2 22.5 servings.
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PUM
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Abstract
The invention relates to an organosilicon sealant for LED (light-emitting diode) packaging, belonging to the technical field of organosilicon sealants. The organosilicon sealant comprises a component A and a component B. The component A comprises 15-25 parts of divinyl polydimethylsiloxane silicon resin and 2-6 parts of platinum catalyst. The component B comprises 50-58 parts of divinyl polydimethylsiloxane silicon resin, 50-88 parts of methylhydropolysiloxane, 2-8 parts of reaction inhibitor, 30-40 parts of fumed silica, 2-10 parts of additive KH-560 and 20-25 parts of TiO2. The vinyl silicon resin, hydrogen-containing silicon oil and tetramethyltetravinylcyclosiloxane are subjected to addition reaction under the condition of the platinum catalyst to prepare the organosilicon electronic packaging adhesive with favorable comprehensive properties. The sealant is very suitable for LED packaging.
Description
technical field [0001] The invention relates to a silicone sealant, more specifically, the invention relates to a silicone sealant for LED potting, which belongs to the technical field of silicone sealants. Background technique [0002] Addition-type liquid silicone rubber uses vinyl-containing organopolysiloxane as the base polymer and silicon-hydrogen bond-containing organopolysiloxane as the cross-linking agent. Under the action of a platinum catalyst, the addition process is carried out at room temperature or under heating. A silicone potting material with a wide range of uses prepared by Lianhe. The organosilicon potting material prepared by this mechanism has no small molecular substances released during vulcanization, its shrinkage rate is extremely low, the stress is small, the cross-linking structure is easy to control, and it is easy to produce high-purity, high-transparency, flame-retardant products, and does not It contains solvents, is non-corrosive, has good f...
Claims
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Application Information
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