Self-crosslinking type LED package adhesive resin and preparing method thereof

A technology of LED encapsulation and adhesive resin, which is applied in the field of self-crosslinking LED encapsulation adhesive resin and its preparation, can solve the problems of poor compatibility and uneven mixing, and achieve the effects of mild reaction, simple preparation process and mild reaction conditions

Active Publication Date: 2015-12-09
浙江安贝新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It greatly reduces the technical problems such as uneven mixing and poor compatibility that are prone to occur in the current double-package silicone encapsulant

Method used

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  • Self-crosslinking type LED package adhesive resin and preparing method thereof
  • Self-crosslinking type LED package adhesive resin and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A self-crosslinking type LED encapsulation adhesive resin, calculated in parts by weight, the composition and content of the raw materials used for its preparation are as follows:

[0035] 100 parts of phenyltrimethoxysilane

[0036] 100 parts of diphenyldimethoxysilane

[0037] Vinyl ring body 20 parts

[0038] 30 parts of hydrogen-containing double head

[0039] 20 parts of distilled water

[0040] 100 parts of solvent

[0041] 0.03 parts of catalyst;

[0042] Described solvent is by toluene and benzene, calculates by weight ratio, namely toluene: benzene is the mixture that the ratio of 1:1 forms;

[0043] The catalyst is an aqueous solution of hydrochloric acid with a concentration of 38% by mass.

[0044] The above-mentioned preparation method of a self-crosslinking type LED encapsulation resin, the steps are as follows:

[0045] Add 100g of phenyltrimethoxysilane, 100g of diphenyldimethoxysilane, 20g of vinyl rings, 30g of hydrogen-containing double caps, 2...

Embodiment 2

[0053] A self-crosslinking type LED encapsulation adhesive resin, calculated in parts by weight, the composition and content of the raw materials used for its preparation are as follows:

[0054] 105 parts of phenyltrimethoxysilane

[0055] 120 parts of diphenyldimethoxysilane

[0056] Vinyl ring body 10 parts

[0057] Hydrogen-containing double head 50 parts

[0058] 60 parts of distilled water

[0059] 200 parts of solvent

[0060] Catalyst 0.05 parts

[0061] Described solvent is toluene;

[0062] The catalyst is an aqueous sulfuric acid solution with a concentration of 98% by mass.

[0063] The above-mentioned preparation method of a self-crosslinking type LED encapsulation resin, the steps are as follows:

[0064] Add 105g of phenyltrimethoxysilane, 120g of diphenyldimethoxysilane, 10g of vinyl ring, 50g of hydrogen-containing double head, 60g of distilled water, 200g of solvent, and 0.05g of catalyst into the container in sequence, and raise the temperature to 60 ...

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Abstract

The invention discloses self-crosslinking type LED package adhesive resin and a preparing method thereof. According to the preparing method, 100-105 weight parts of phenyltrimethoxysilane, 100-120 weight parts of diphenyldimethoxysilane, 10-20 weight parts of methyl-vinyl-cyclosiloxane, 30-50 weight parts of disiloxane, 20-60 weight parts of distilled water, 100-200 weight parts of solvent and 0.03-0.05 weight part of catalyst are sequentially added to a container, constant-temperature stirring is conducted for 3-5 h at 60-80 DEG C, stirring reaction is conducted for 4-8 h after temperature is increased to 100-120 DEG C, the pH value of obtained reaction liquid is adjusted to be 7, then reduced pressure distillation is conducted so as to remove the solvent and residual water, and finally the self-crosslinking type LED package adhesive resin high in light transmittance and refraction index is obtained. The resin can achieve self-crosslinking curing reaction under a certain condition, and the thermal decomposition temperature of a cured product is quite high.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a self-crosslinking LED packaging adhesive resin and a preparation method thereof. Background technique [0002] In recent years, the high-power LED packaging industry has developed rapidly, and organic silicon with high light transmittance, high refractive index and good thermal stability is used as high-power LED packaging materials. The silicone resin used for encapsulation is generally stored in double packages for low temperature storage. The vinyl phenyl silicone resin is in one package, and the cross-linking agent is in the other package. When encapsulating LEDs, it is prepared and used immediately, and then cured to complete the encapsulation. The main problems of such compounding are: on the one hand, when the refractive difference between vinyl phenyl silicone resin and crosslinking agent is large, the difference in molecular structure between the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20
Inventor 张英强张轩凝赵永新梁华丽吴明刚
Owner 浙江安贝新材料股份有限公司
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