Thermal resistant light curing solder resist ink

A technology of solder resist ink and light curing, which is applied in the field of ink, can solve the problems of poor heat resistance, slow curing speed, unfavorable use of solder resist ink, etc., and achieve the effects of strong heat resistance, fast curing speed, and faster fixing speed

Inactive Publication Date: 2015-12-09
佛山市鑫正化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing light-curable solder resist inks often have slow curing speed and

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] Example 1

[0033] A heat-resistant light-curing solder mask ink, consisting of the following parts by weight:

[0034] 25 parts of polyurethane-modified acrylic resin; 32 parts of hyperbranched resin; 8 parts of propylene oxide pentaerythritol tetraacrylate; 10 parts of divinyl-1,4-butanediol ether; and tetrahydrophthalate diglycidyl ester 11 Parts; talc 12 parts; carbon black 10 parts; antifoaming agent 1.5 parts; leveling agent 1.5 parts; dispersing agent 1.5 parts; bis(2,4,6-trimethylbenzoyl)phenyl phosphine oxide 4 parts .

[0035] The test shows that the curing speed of this embodiment is 10s.

[0036] The performance test methods and results are as follows:

[0037] Pre-baking (75°C): 25 minutes. After pre-baking, the ink does not stick to your hands.

[0038] Post-baking (180℃): 60 minutes. After post-baking, the ink does not turn yellow.

[0039] Exposure machine exposure: exposure energy 550mJ / cm 2 , Exposure level: 11 levels.

[0040] Developer developing: 1%Na 2 CO 3...

Example Embodiment

[0046] Example 2

[0047] A heat-resistant light-curing solder mask ink, consisting of the following parts by weight:

[0048] 28 parts of polyurethane modified acrylic resin; 26 parts of hyperbranched resin; 6 parts of propylene oxide pentaerythritol tetraacrylate; 12 parts of divinyl-1,4-butanediol ether; and 12 parts of tetrahydrophthalate diglycidyl ester Parts; 15 parts of kaolin; 3 parts of carbon black; 1 part of antifoaming agent; 1 part of leveling agent; 1 part of dispersant; 5 parts of bis(2,4,6-trimethylbenzoyl)phenyl phosphine oxide.

[0049] The test shows that the curing speed of this embodiment is 10s.

[0050] The performance test methods and results are as follows:

[0051] Pre-baking (75°C): 25 minutes. After pre-baking, the ink does not stick to your hands.

[0052] Post-baking (180℃): 60 minutes. After post-baking, the ink does not turn yellow.

[0053] Exposure machine exposure: exposure energy 550mJ / cm 2 , Exposure level: 11 levels.

[0054] Developer developing:...

Example Embodiment

[0060] Example 3

[0061] A heat-resistant light-curing solder mask ink, consisting of the following parts by weight:

[0062] 22 parts of polyurethane-modified acrylic resin; 37 parts of hyperbranched resin; 9 parts of propylene oxide pentaerythritol tetraacrylate; 9 parts of divinyl-1,4-butanediol ether; and 11 parts of tetrahydrophthalic acid diglycidyl ester Parts; 11 parts of kaolin; 13 parts of carbon black; 1 part of defoamer; 1 part of leveling agent; 1 part of dispersant; 2 parts of bis(2,4,6-trimethylbenzoyl)phenyl phosphine oxide.

[0063] The test shows that the curing speed of this embodiment is 10s.

[0064] The performance test methods and results are as follows:

[0065] Pre-baking (75°C): 25 minutes. After pre-baking, the ink does not stick to your hands.

[0066] Post-baking (180℃): 60 minutes. After post-baking, the ink does not turn yellow.

[0067] Exposure machine exposure: exposure energy 550mJ / cm 2 , Exposure level: 10 levels.

[0068] Developer developing: 1%Na...

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Abstract

The invention relates to the field of ink, in particular to thermal resistant light curing solder resist ink. The thermal resistant light curing solder resist ink is prepared from, by weight, 20-30 parts of polyurethane modified acrylic resin, 25-40 parts of hyperbranched resin, 20-40 parts of reactive diluents, 10-15 parts of inorganic filler, 0-15 parts of pigments, 0-6 parts of functional promoter and 2-6 parts of photoinitiator. Compared with home-produced traditional solder resist ink, the thermal resistant light curing solder resist ink has the advantages of being high in curing speed, strong in adhesive force, excellent in thermal resistance, soldering resistance and yellowing resistance and the like, and the thermal resistant light curing solder resist ink is specially suitable for solder resist ink for LEDs.

Description

technical field [0001] The invention relates to the field of inks, in particular to a heat-resistant photocurable solder resist ink. Background technique [0002] Solder resist ink is one of the key materials in the chemicals used in the manufacture of printed circuit boards. It can prevent scratches on the wires and short circuits between the wires during soldering. At the same time, it can also make the wires moisture-resistant, chemical-resistant, Therefore, the research and development of solder resist ink has always occupied a very important position in the progress of printed circuit board technology. However, the existing light-curable solder resist inks often have slow curing speed and poor heat resistance, which is not conducive to the further use of solder resist inks. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a photocurable solder resist ink with fast curing speed and good heat resistance. ...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/104C09D11/107C09D11/033C09D11/03
Inventor 陈锦
Owner 佛山市鑫正化工有限公司
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