Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermal resistant light curing solder resist ink

A technology of solder resist ink and light curing, which is applied in the field of ink, can solve the problems of poor heat resistance, slow curing speed, unfavorable use of solder resist ink, etc., and achieve the effects of strong heat resistance, fast curing speed, and faster fixing speed

Inactive Publication Date: 2015-12-09
佛山市鑫正化工有限公司
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing light-curable solder resist inks often have slow curing speed and poor heat resistance, which is not conducive to the further use of solder resist inks.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A heat-resistant photocurable solder resist ink, consisting of the following components in parts by weight:

[0034] 25 parts polyurethane-modified acrylic resin; 32 parts hyperbranched resin; 8 parts propoxylated pentaerythritol tetraacrylate; 10 parts divinyl-1,4-butanediol ether; and 11 parts diglycidyl tetrahydrophthalate 12 parts of talcum powder; 10 parts of carbon black; 1.5 parts of defoamer; 1.5 parts of leveling agent; 1.5 parts of dispersant; .

[0035] After testing, it can be seen that the curing speed of this embodiment is 10s.

[0036] The performance test methods and results are as follows:

[0037] Pre-bake (75°C): 25 minutes. After prebaking, the ink is not sticky.

[0038] Post bake (180°C): 60 minutes. After post-baking, the ink does not yellow.

[0039] Exposure machine exposure: exposure energy 550mJ / cm 2 , Exposure level: level 11.

[0040] Developing machine development: 1%Na 2 CO 3 Aqueous solution, developed for 60s, developed cleanly...

Embodiment 2

[0047] A heat-resistant photocurable solder resist ink, consisting of the following components in parts by weight:

[0048] 28 parts polyurethane-modified acrylic resin; 26 parts hyperbranched resin; 6 parts propoxylated pentaerythritol tetraacrylate; 12 parts divinyl-1,4-butanediol ether; and 12 parts diglycidyl tetrahydrophthalate 15 parts of kaolin; 3 parts of carbon black; 1 part of defoamer; 1 part of leveling agent;

[0049] After testing, it can be seen that the curing speed of this embodiment is 10s.

[0050] The performance test methods and results are as follows:

[0051] Pre-bake (75°C): 25 minutes. After prebaking, the ink is not sticky.

[0052] Post bake (180°C): 60 minutes. After post-baking, the ink does not yellow.

[0053] Exposure machine exposure: exposure energy 550mJ / cm 2 , Exposure level: level 11.

[0054] Developing machine development: 1%Na 2 CO 3 Aqueous solution, developed for 60s, developed cleanly.

[0055] Adhesion (GB / T9286-1998): Leve...

Embodiment 3

[0061] A heat-resistant photocurable solder resist ink, consisting of the following components in parts by weight:

[0062] 22 parts polyurethane-modified acrylic resin; 37 parts hyperbranched resin; 9 parts propoxylated pentaerythritol tetraacrylate; 9 parts divinyl-1,4-butanediol ether; and 11 parts diglycidyl tetrahydrophthalate 11 parts of kaolin; 13 parts of carbon black; 1 part of defoamer; 1 part of leveling agent;

[0063] After testing, it can be seen that the curing speed of this embodiment is 10s.

[0064] The performance test methods and results are as follows:

[0065] Pre-bake (75°C): 25 minutes. After prebaking, the ink is not sticky.

[0066] Post bake (180°C): 60 minutes. After post-baking, the ink does not yellow.

[0067] Exposure machine exposure: exposure energy 550mJ / cm 2 , Exposure level: 10 levels.

[0068] Developing machine development: 1%Na 2 CO 3 Aqueous solution, developed for 60s, developed cleanly.

[0069] Adhesion (GB / T9286-1998): Lev...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Heat resistance temperatureaaaaaaaaaa
Heat resistance temperatureaaaaaaaaaa
Heat resistance temperatureaaaaaaaaaa
Login to View More

Abstract

The invention relates to the field of ink, in particular to thermal resistant light curing solder resist ink. The thermal resistant light curing solder resist ink is prepared from, by weight, 20-30 parts of polyurethane modified acrylic resin, 25-40 parts of hyperbranched resin, 20-40 parts of reactive diluents, 10-15 parts of inorganic filler, 0-15 parts of pigments, 0-6 parts of functional promoter and 2-6 parts of photoinitiator. Compared with home-produced traditional solder resist ink, the thermal resistant light curing solder resist ink has the advantages of being high in curing speed, strong in adhesive force, excellent in thermal resistance, soldering resistance and yellowing resistance and the like, and the thermal resistant light curing solder resist ink is specially suitable for solder resist ink for LEDs.

Description

technical field [0001] The invention relates to the field of inks, in particular to a heat-resistant photocurable solder resist ink. Background technique [0002] Solder resist ink is one of the key materials in the chemicals used in the manufacture of printed circuit boards. It can prevent scratches on the wires and short circuits between the wires during soldering. At the same time, it can also make the wires moisture-resistant, chemical-resistant, Therefore, the research and development of solder resist ink has always occupied a very important position in the progress of printed circuit board technology. However, the existing light-curable solder resist inks often have slow curing speed and poor heat resistance, which is not conducive to the further use of solder resist inks. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a photocurable solder resist ink with fast curing speed and good heat resistance. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09D11/101C09D11/104C09D11/107C09D11/033C09D11/03
Inventor 陈锦
Owner 佛山市鑫正化工有限公司
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com