A kind of thermosetting solder resist ink composition
A technology of solder resist ink and composition, which is applied in the direction of ink, household utensils, applications, etc., can solve the problems of poor heat resistance, unfavorable use of solder resist ink, high curing temperature, etc., and achieve strong heat resistance, excellent adhesion, and solidification The effect of low temperature
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Embodiment 1
[0033] A thermosetting solder resist ink composition, consisting of the following components in parts by weight:
[0034] 18 parts of linear polyester with carboxyl group; 20 parts of hyperbranched resin; 3 parts of ethylene glycol diglycidyl ether; 3 parts of polypropylene glycol diglycidyl ether; 4 parts of triglycidyl isocyanurate; 12 parts of calcium carbonate 15 parts of aluminum hydroxide; 10 parts of carbon black; 1 part of defoamer; 1 part of leveling agent; 1 part of antioxidant; 13 parts of acetone; 2 parts of triethylenetetramine.
[0035] After testing, it can be seen that the curing temperature of this embodiment is 90°C.
[0036] When in use, dry and solidify within 90-100°C for 2 minutes. The dry film thickness is controlled at 25-30 μm. Then it was aged in a forced air oven at 100° C. for 60 minutes.
[0037] The performance test methods and results are as follows:
[0038] Pre-bake (75°C): 25 minutes. After prebaking, the ink is not sticky.
[0039] Post...
Embodiment 2
[0046] A thermosetting solder resist ink composition, consisting of the following components in parts by weight:
[0047] 28 parts of linear polyester whose terminal group is carboxyl; 12 parts of hyperbranched resin; 2 parts of ethylene glycol diglycidyl ether; 4 parts of polypropylene glycol diglycidyl ether; 6 parts of triglycidyl isocyanurate; 20 parts of barium sulfate 10 parts of aluminum hydroxide; 13 parts of carbon black; 1 part of defoamer; 1 part of leveling agent; 1 part of antioxidant; 18 parts of propylene glycol methyl ether acetate; 3 parts of triethylenetetramine.
[0048] After testing, it can be seen that the curing temperature of this embodiment is 90°C.
[0049] When in use, dry and solidify within 90-100°C for 2 minutes. The dry film thickness is controlled at 25-30 μm. Then it was aged in a forced air oven at 100° C. for 60 minutes.
[0050] The performance test methods and results are as follows:
[0051] Pre-bake (75°C): 25 minutes. After prebakin...
Embodiment 3
[0059] A thermosetting solder resist ink composition, consisting of the following components in parts by weight:
[0060] 16 parts of linear polyester whose terminal group is carboxyl group; 23 parts of hyperbranched resin; 4 parts of ethylene glycol diglycidyl ether; 2 parts of polypropylene glycol diglycidyl ether; 3 parts of triglycidyl isocyanurate; 15 parts of barium sulfate 15 parts of calcium carbonate; 13 parts of carbon black; 1 part of defoamer; 1 part of leveling agent; 1 part of antioxidant; 2 parts of ethylene glycol ether; 1 part of triethylenetetramine.
[0061] After testing, it can be seen that the curing temperature of this embodiment is 90°C.
[0062] When in use, dry and solidify within 90-100°C for 2 minutes. The dry film thickness is controlled at 25-30 μm. Then it was aged in a forced air oven at 100° C. for 60 minutes.
[0063] The performance test methods and results are as follows:
[0064] Pre-bake (75°C): 25 minutes. After prebaking, the ink is...
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Abstract
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