Anti-immersion gold, anti-cracking matte white photosensitive solder resist material and preparation method thereof

A photosensitive solder resist and anti-cracking technology, which is applied in photosensitive materials used in optomechanical equipment, optomechanical equipment, optics, etc., can solve problems such as darkening of color, insufficient temperature resistance of resin, and sticking back when heated, to achieve optimal The effect of heat resistance

Active Publication Date: 2019-11-01
江门市阪桥电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, some currently use polyester resin and amino resin system as the main resin, which has been improved in terms of flexibility. However, due to the insufficient temperature resistance of the resin during reflow soldering, the phenomenon of back-sticking and darkening of the color occurs when the temperature rises. It is important that these resins cannot be washed off with alkaline water after heat curing

Method used

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  • Anti-immersion gold, anti-cracking matte white photosensitive solder resist material and preparation method thereof
  • Anti-immersion gold, anti-cracking matte white photosensitive solder resist material and preparation method thereof
  • Anti-immersion gold, anti-cracking matte white photosensitive solder resist material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0024] The preparation method of the main agent: every 750g of the main agent is mainly composed of 240g of acrylic acid end-blocking modified pure acrylic resin, 160g of acrylic resin, 2g of ITX, 10g of TPO, 8198g, 10g of dispersant, 20g of DBE, 8g of meteorological silica, Mix 40g of barium sulfate, 240g of titanium dioxide, and 12g of defoamer, and stir for 40 minutes with a high-speed disperser at a speed of 500 RMP, then use a three-roller mill with a fineness of less than 15 μm, and then filter to remove mechanical impurities, and finally adjust the viscosity to 280dpa.s. The preparation of the agent is completed; the acrylic acid end-capped modified pure acrylic resin is SNK-3000-A2B6.

Embodiment 2

[0026] The preparation method of the main agent: every 750g of the main agent is mainly composed of 300g of acrylic acid end-blocking modified pure acrylic resin, 100g of acrylic resin, 2g of ITX, 10g of TPO, 8g of 819, 10g of dispersant, 20g of DBE, meteorological dioxide Mix 8g of silicon, 30g of barium sulfate, 220g of titanium dioxide, and 12g of defoamer, stir for 40 minutes using a high-speed disperser at a speed of 500 RMP, then use a three-roller mill with a fineness of less than 15 μm, add 30 g of matting powder, and then stir with a high-speed disperser at a speed of 500 rpm After 40 minutes, filter to remove mechanical impurities, finally adjust the viscosity to 280dpa.s, and complete the preparation of the main ingredient; the acrylic acid end-blocking modified pure acrylic resin is SNK-3000-A2B6.

Embodiment 3

[0028] The preparation method of the curing agent: every 250g of the curing agent is mainly composed of 40g of thermal curing resin, 8g of polyurethane acrylate, 7g of melamine, 60g of DPHA, 35g of triglycidyl isocyanurate, 90g of titanium dioxide, and 10g of DBE, using a high-speed disperser Stir at a speed of 500 RMP for 40 minutes, then use a three-roll mill to make the fineness less than 15 μm, then filter to remove mechanical impurities, and finally adjust the viscosity to 180dpa.s, and the curing agent is completed. The thermosetting resin is PNE-177.

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Abstract

The invention discloses a matt-white immersion-gold-resistant, anti-cracking and light-sensing solder mask material and a preparation method thereof. The matt-white immersion-gold-resistant, anti-cracking and light-sensing solder mask material mainly comprises a main agent and a curing agent, wherein the main agent comprises acrylic resin with a special function, acrylic resin, a photoinitiator, a dispersing agent, dibasic ester, fumed silica, barium sulfate, titanium dioxide and an antifoaming agent; the curing agent comprises thermocuring resin, a curing additive, melamine, a photocuring monomer, triglycidyl isocyanurate, titanium dioxide and dibasic ester. The prepared matt-white light-sensing solder mask material has high immersion gold resistance and yellowing resistance, and is more stable and reliable during normal technology use of a PCB (printed circuit board).

Description

technical field [0001] The invention relates to the technical field of precision circuit boards, in particular to an anti-immersion gold, anti-cracking matte white photosensitive solder resist material and a preparation method thereof. Background technique [0002] With the rapid development of the international IT industry, LCD-related industries continue to introduce new ones, and the size of LCD products is developing in the direction of diversification and portability. portability. [0003] The backlight is a light source located behind the liquid crystal display (LCD), and its luminous effect will directly affect the visual effect of the liquid crystal display module (LCM). The traditional LED light strip is composed of a flexible flexible circuit board substrate, hot-pressed with a layer of white covering film on the front and back, or directly coated with white solder resist material. In addition to the functions of insulation, solder resistance, and circuit protect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004
Inventor 周中涛
Owner 江门市阪桥电子材料有限公司
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