Silicon-based ceramic surface metallization method

A ceramic surface and metallization technology, which is applied in metal processing equipment, welding media, welding/cutting media/materials, etc., can solve the problem of low connection strength and reliability between connecting components and silicon-based ceramics, high residual stress at the connection interface, and metal In order to improve the connection strength and connection reliability, easy and reliable connection, and high repeatability

Inactive Publication Date: 2015-12-16
HARBIN INST OF TECH
View PDF5 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of complex surface metallization methods of silicon-based ceramics in the prior art, poor compatibility between the surface of silicon-based ceramics and alloy solder, high residual stress at the connection interface between silicon-based

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon-based ceramic surface metallization method
  • Silicon-based ceramic surface metallization method
  • Silicon-based ceramic surface metallization method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0031] Specific embodiment 1: The method for metallizing the surface of silicon-based ceramics in this embodiment is implemented in the following steps:

[0032] Step 1: Preparation of Ti-Si alloy solder

[0033] According to weight percentage, weigh 72%~78% sponge Ti and the balance of single crystal Si, and put the weighed sponge Ti and single crystal Si into a non-consumable electric arc furnace for vacuum smelting until the solder has a uniform eutectic structure , Get Ti-Si alloy solder;

[0034] Step 2: Preparation of Ti-Si alloy solder sheet

[0035] Cut the Ti-Si alloy brazing filler metal obtained in step 1 into Ti-Si alloy brazing filler metal sheets with a thickness of 0.5 mm to 1 mm with a wire-cut EDM machine, and then double-cut the Ti-Si alloy brazing filler metal sheet with 1200# sandpaper. The surface is polished, and finally ultrasonically cleaned twice in acetone for 10-20 minutes each time;

[0036] Step three, silicon-based ceramic deoxidation treatment

[0037] Us...

Example Embodiment

[0045] Specific embodiment two: this embodiment is different from specific embodiment one in that in step one, 75% of sponge Ti and the balance of single crystal Si are weighed out by weight percentage. The other steps and parameters are the same as in the first embodiment.

Example Embodiment

[0046] Specific embodiment three: this embodiment is different from specific embodiment one or two in: the purity of sponge Ti mentioned in step one> 99.97%; the purity of the single crystal Si> 99.99%. The other steps and parameters are the same as in the first or second embodiment.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Lengthaaaaaaaaaa
Widthaaaaaaaaaa
Login to view more

Abstract

The invention relates a silicon-based ceramic surface metallization method. The problems that an existing silicon-based ceramic surface metallization method is complex, the compatibility of the silicon-based ceramic surface and alloy brazing filler metal is poor, the residual stress of a connecting interface of silicon-based ceramic and alloy brazing filler metal is high, the silicon-based ceramic wettability of the alloy brazing filler metal is poor, and the connecting strength and reliability of a connecting element and the silicon-based ceramic are low are solved. The method comprises the steps of firstly, preparing Ti-Si alloy brazing filler metal; secondly, preparing Ti-Si alloy brazing filler metal sheets; thirdly, performing deoxidation treatment on the silicon-based ceramic; fourthly, performing surface metallization on the silicon-based ceramic. According to the method, the compatibility of the silicon-based ceramic and the alloy brazing filler metal is improved, the connector stress of the silicon-based ceramic is effectively relieved, the connector strength and reliability are improved, the silicon-based ceramic wettability of the alloy brazing filler metal is improved, the technology is simple, the repeatability is high, and the application range is wide. The method is used for silicon-based ceramic surface metallization.

Description

technical field [0001] The invention relates to a method for metallizing the surface of silicon-based ceramics. Background technique [0002] Silicon-based ceramics have important industrial and military application prospects due to their excellent chemical, thermal and mechanical properties, and are one of the most potential structural ceramic materials. However, due to the inherent brittleness and hardness of silicon-based ceramic materials, the technical difficulties in preparation, especially the molding and processing technology are the key to restricting the large-scale, complex shape and high-reliability applications of silicon-based ceramic devices. Ceramic joining technology is an effective means for the practical application of silicon-based ceramics. On the one hand, it makes the preparation of complex parts possible, and on the other hand, it can greatly reduce expensive processing costs. [0003] Silicon-based ceramics are usually connected by alloy solder, but...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K1/008B23K1/20B23K35/32B23K1/19
CPCB23K1/008B23K1/19B23K1/20B23K1/206B23K35/0233B23K35/325
Inventor 林铁松何鹏赵万祺
Owner HARBIN INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap