Novel cyanide-free alkaline copper plating solution and preparation method thereof

Abstract

The invention discloses a novel cyanide-free alkaline copper plating solution which comprises the following components: 120-180 g / L of sodium citrate, 20-30 g / L of copper sulfate, 25-35 g / L of sodium potassium tartrate tetrahydrate, 6-10 g / L of sodium bicarbonate, 30-40 g / L of cyani salt, 1-3 ml / L of a brightener and 0.5-0.9 / L of tea saponin. The novel cyanide-free alkaline copper plating solution, disclosed by the invention, has the following advantages: the stability is excellent, the clad layer crystal is delicate, the covering power is excellent, the current range is wide, a semi-bright clad layer is excellent in binding force, the clad layer with the thickness of more than 10 microns can be plated, and traditional toxic cyaniding copper plating can be replaced.

Description

technical field [0001] The invention relates to a cyanide-free alkaline copper plating solution and a preparation method thereof, belonging to the field of electroplating solutions. Background technique [0002] Copper has good electrical conductivity, thermal conductivity and ductility, but the chemical stability of copper is poor. Generally, it is only used as the middle layer or bottom layer of other coatings to improve the bonding force between the coating and the base metal. If it needs to be used alone as a decoration When plating, it must be coated with an organic coating on its surface or after coloring treatment and then coated with an organic coating. [0003] The copper plating process is divided into two categories: cyanide copper plating process and cyanide-free copper plating process. The copper plating layer obtained by the cyanide copper plating process has fine crystals and small porosity, but the cyanide copper plating process contains highly toxic CN?, an...

AI Technical Summary

Problems solved by technology

The copper plating layer obtained by the cyanide copper plating process has fine crystals and small porosity, but the cyanide copper plating process contains highly toxic CN?, and there are huge safety hazards in the entire process control and maintenance process. Therefore, there is no need for research and development. Cyanide copper plating process has become the general trend

So far, cyanide-free copper plating mainly includes pyrophosphate series, sulfate series, citric acid series, HEDP series, etc., but these cyanide-free copper plating processes are still not comparable to the cyanide copper plating process, and there are many problems to be solved urgently. Such as the color and luster of the coating, the brightness and the stability of the plating solution, etc.

[0004] There are two difficulties in the application of cyanide-free copper plating in actual production: one is the bonding force between the coating and the steel substrate, and the other is the stability of the solution.