The invention discloses a cyanide-free alkaline copper plating process capable of recovering waste liquid. The cyanide-free alkaline copper plating process comprises the steps of preparing a plating agent, adjusting pH value, heating a plating solution and electroplating. The cyanide-free alkaline copper plating process comprises the steps that water with a volume ratio of at least 50% is added into a plating bath, preparing of is the plating agent is carried out according to the raw material composition ratio, the plating agent is added into the plating bath, water is added to dissolve and adjust the pH value of the plating solution, the plating bath is heated, the plating solution is heated, energizing and plating are carried out, and the plating solution is continuously filtered. According to the cyanide-free alkaline copper plating process capable of recovering the waste liquid, through creative improvement of the raw material ratio and the process flow, the copper plating processcan better process materials and has better copper plating effect, and is suitable for any metal substrate such as pure copper, copper alloy, iron, stainless steel, zinc alloy die castings, aluminum and aluminum alloy workpieces. At the same time, the waste liquid produced after copper plating can be collected, more energy conservation and environment prevention are achieved, the copper plating effect is better, the cost required by the copper plating process is effectively reduced, and the cyanide-free alkaline copper plating process is suitable for promotion in the market.