Flame-retardant polyamide fiber
A technology for flame retardant polyamide and polyamide fibers, applied in the field of flame retardant polyamide fibers, can solve the problems of unsatisfactory and unsatisfactory flame retardant performance, and achieve the effects of low cost, improved flame retardant performance and simple process
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Embodiment 1
[0027] Party:
[0028] 50 parts of polycaprolactam, 10 parts of epoxy resin, 5 parts of formaldehyde resin, 1 part of tetrakis hydroxymethyl phosphorus chloride,
[0029] 1 part of pentaerythritol, 2 parts of ammonium dihydrogen phosphate, 5 parts of decabromodiphenyl ether, 0.1 part of antimony trioxide,
[0030] 0.5 parts of nano silicon dioxide, 1 part of adhesive
[0031] The molecular weight of the epoxy resin is 5000.
[0032] Preparation:
[0033] (1) Take polyamide fiber, epoxy resin and formaldehyde resin, heat and melt to obtain the primary material;
[0034] (2) Take tetrakis hydroxymethyl phosphorus chloride, pentaerythritol and ammonium dihydrogen phosphate, grind them into fine powder, add them to the above-mentioned raw material, add decabromodiphenyl ether, heat and stir to obtain the intermediate material;
[0035] (3) Take antimony trioxide and nano silicon dioxide, mix them with the above-mentioned intermediate material, add binder, continue to melt, sti...
Embodiment 2
[0037] Party:
[0038] 50 parts of polyhexamethylene adipamide, 20 parts of epoxy resin, 15 parts of formaldehyde resin, 9 parts of tetrakis hydroxymethyl phosphorus chloride,
[0039] 7 parts of pentaerythritol, 8 parts of ammonium dihydrogen phosphate, 15 parts of decabromodiphenyl ether, 0.9 parts of antimony trioxide,
[0040] 1.5 parts of nano silicon dioxide, 5 parts of adhesive
[0041] The molecular weight of the epoxy resin is 7000.
[0042] Preparation:
[0043] (1) Take polyamide fiber, epoxy resin and formaldehyde resin, heat and melt to obtain the primary material;
[0044] (2) Take tetrakis hydroxymethyl phosphorus chloride, pentaerythritol and ammonium dihydrogen phosphate, grind them into fine powder, add them to the above-mentioned raw material, add decabromodiphenyl ether, heat and stir to obtain the intermediate material;
[0045] (3) Take antimony trioxide and nano silicon dioxide, mix them with the above-mentioned intermediate material, add binder, con...
Embodiment 3
[0047] Party:
[0048] 50 parts of polybutylene adipamide, 15 parts of epoxy resin, 10 parts of formaldehyde resin, 5 parts of tetrakis hydroxymethyl phosphorus chloride,
[0049] 4 parts of pentaerythritol, 5 parts of ammonium dihydrogen phosphate, 10 parts of decabromodiphenyl ether, 0.5 parts of antimony trioxide,
[0050] Nano silicon dioxide 1 part, adhesive 3 parts
[0051] The molecular weight of the epoxy resin is 6000.
[0052] Preparation:
[0053] (1) Take polyamide fiber, epoxy resin and formaldehyde resin, heat and melt to obtain the primary material;
[0054] (2) Take tetrakis hydroxymethyl phosphorus chloride, pentaerythritol and ammonium dihydrogen phosphate, grind them into fine powder, add them to the above-mentioned raw material, add decabromodiphenyl ether, heat and stir to obtain the intermediate material;
[0055] (3) Take antimony trioxide and nano silicon dioxide, mix them with the above-mentioned intermediate material, add binder, continue to melt,...
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