Solid-state imaging element, manufacturing method for same, curable composition for forming infrared cutoff filter, and camera module

A solid-state imaging element and a technology for a cut-off filter are applied to the solid-state imaging element of an infrared cut-off filter and its manufacture, a curable composition for forming an infrared cut-off filter, and a camera module field, which can solve the problems of increasing the number of pixels and the like , to achieve the effect of full infrared light shading ability

Inactive Publication Date: 2015-12-23
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, the main focus has been on increasing the number of pixels, but there are also attempts to improve image quality using techniques other than pixel count

Method used

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  • Solid-state imaging element, manufacturing method for same, curable composition for forming infrared cutoff filter, and camera module
  • Solid-state imaging element, manufacturing method for same, curable composition for forming infrared cutoff filter, and camera module
  • Solid-state imaging element, manufacturing method for same, curable composition for forming infrared cutoff filter, and camera module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0373] Hereinafter, examples of the present invention will be described, but the present invention is not limited to these examples. In addition, unless otherwise indicated, "part" and "%" are a mass basis.

Synthetic example 1

[0374] (Synthesis Example 1: Binder A)

[0375] 159 g of 1-methoxy-2-propanol was added to a 1,000 mL three-necked flask, and it heated to 85 degreeC under nitrogen stream. Prepared by adding 63.4 g of benzyl methacrylate, 72.3 g of methacrylic acid, and 4.15 g of V-601 (manufactured by Wako Pure Chemical Industries) to 159 g of 1-methoxy-2-propanol dropwise over 2 hours. solution. After completion of the dropwise addition, the reaction was further heated for 5 hours.

[0376] Then, heating was stopped, and the copolymer of benzyl methacrylate / methacrylic acid (30 / 70 mol ratio) was obtained.

[0377] Next, 120.0 g of the copolymer solution was transferred to a 300 mL three-necked flask, 16.6 g of glycidyl methacrylate and 0.16 g of p-methoxyphenol were added, stirred and dissolved. After dissolving, 3.0 g of triphenylphosphine was added, and it heated to 100 degreeC, and added reaction was performed. The disappearance of glycidyl methacrylate was confirmed by gas chromatog...

Synthetic example 2

[0378] (Synthesis Example 2: Binder D)

[0379] (ACA) 230AA (acid-group-containing methacrylic resin manufactured by Daicel-Cytec Co., Ltd. (acid group content is 0.7meq / g, cross-linking group content is 1.9meq / g) g, a weight average molecular weight of 14000 (polystyrene conversion value obtained by GPC method))) in a propylene glycol monomethyl ether (PGME; alias 1-methoxy-2-propanol) solution having a solid content of 55% by mass , PGME was further added to prepare a binder D solution having a solid content of 40% by mass.

[0380] (Red (Red) pigment dispersion: dispersion containing PR254 / PY139)

[0381] Using a bead mill (zirconia beads with a diameter of 0.3 mm), 9.6 parts of pigment red (PigmentRed) 254, 4.3 parts of pigment yellow (PigmentYellow) 139, 6.8 parts of pigment dispersant Bi Ke (BYK)-161 (manufactured by BYK) and 79.3 parts of propylene glycol methyl ether acetate (hereinafter referred to as "PGMEA") were mixed and dispersed for 3 hours to prepare a pigmen...

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PUM

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Abstract

The present invention provides: a solid-state imaging element equipped with an infrared cutoff filter which can suppress the deterioration of the optical properties of three adjacent primary color filters; a manufacturing method for the same; a curable composition for forming the infrared cutoff filter; and a camera module. The solid-state imaging element of the present invention has: a semiconductor substrate; a plurality of photoelectric conversion elements which form a plurality of pixels arrayed on the light-receiving surface side of the semiconductor substrate; and a filter layer which is arranged on the light incident side of the plurality of photoelectric conversion elements, and which corresponds to the plurality of photoelectric conversion elements. The filter layer includes at least: a red color filter through which light in the red color wavelength range passes; a green color filter through which light in the green color wavelength range passes; a blue color filter through which light in the blue color wavelength range passes; and an infrared cutoff filter which blocks infrared light. The infrared cutoff filter is arranged adjacent to at least one of the red color filer, the green color filter, and the blue color filter.

Description

technical field [0001] The present invention relates to a solid-state imaging element and a manufacturing method thereof, in particular to a solid-state imaging element including an infrared light cut filter containing tungsten oxide microparticles and a manufacturing method thereof. [0002] Also, the present invention relates to a curable composition for forming an infrared cut filter and a camera module. Background technique [0003] In recent years, in order to improve the image quality of digital cameras, mobile phones, and the like, technological innovations of imaging elements are being carried out. So far, the main focus has been on increasing the number of pixels, but attempts have been made to improve image quality using technologies other than the number of pixels. [0004] For example, Patent Document 1 discloses a color filter (colorfilter) for a solid-state imaging element, which is a filter of the three primary colors of red, green and blue, and an infrared f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/22G02B5/20H01L27/14
CPCG02B5/223H01L27/14618H01L27/14627H01L27/14636H01L27/14621H01L27/14685H01L27/14645H04N23/57H04N23/55
Inventor 留场恒光
Owner FUJIFILM CORP
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