Silica gel based carbon material oriented heat conduction interface material and production method thereof

Abstract

The invention relates to a silica gel based carbon material oriented heat conduction interface material. The material comprises components in percentage by weight as follows: 9.5%-20% of siloxane-based resin with the viscosity being 200 cp-2,000 cp, 19.5%-35% of heat conductive filler, 35%-70% of an anisotropic carbon material and 1%-10% of an auxiliary agent and is prepared with a stirring and curing production method. The silica gel based carbon material oriented heat conduction interface material has the advantages as follows: according to the heat conductive interface material prepared by mixing the siloxane-based resin with the viscosity being 200 cp-2,000 cp, the heat conductive filler, the anisotropic carbon material and the auxiliary agent, the anisotropic carbon material mixed in gel is orientated through electric fields on upper and lower surfaces, longitudinal orientation of the carbon material is realized, the conduction path of the heat conductive material is in the direction where the large heat conduction coefficient is large, and the heat conduction performance is realized to the maximum; with the addition of the heat conductive filler, the defect that the heat conduction performance of the carbon material in direction, perpendicular to the orientation direction, of the carbon material, namely, in the horizontal direction of mixed gel, is poor after the anisotropic carbon material is orientated is overcome, balanced conduction of heat is guaranteed, and a production method is simple.

Description

technical field [0001] The invention relates to a silica gel-based carbon material orientation type heat-conducting interface material and a production method thereof. Background technique [0002] Carbon is a non-metallic element, but it has the electrical and thermal conductivity of metal materials, as well as plasticity like organic plastics, and has special chemical stability, lubrication, and can be coated on solid surfaces. Some good technological properties. Carbon materials have a very large number of isomers, occupying a pivotal low position in terms of thermal properties. The thermal conductivity of different isomers of carbon materials spans a large range—five orders of magnitude—the thermal conductivity of amorphous carbon is 0.01W / m-K, and the thermal conductivity of diamond or graphene at room temperature is About 2000W / m-K. The thermal conductivity of type II diamond reaches 10000W / m-K at a temperature of 77K, and the thermal conductivity of carbon nanotubes...

AI Technical Summary

Problems solved by technology

The thermal conductivity of type II diamond reaches 10000W / m-K at a temperature of 77K, and the thermal conductivity of carbon nanotubes reaches between 3000 and 3500W / m-K at room temperature, surpassing the thermal conductivity of diamond and becoming the highest thermal conductivity. However, the above-mentioned carbon materials all have directionality in thermal conductivity, such as artificial graphite heat sinks, which have ultra-high thermal conductivity in the range of 1500-2500W / m-K in the plane, but only 10-20W / m-K in the vertical direction Thermal properties