Easy-to-repair thermal-conducting gel and preparation method thereof

A gel and repair technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of large amount of residual glue of thermal conductive gel, difficult to repair and other problems, achieve excellent thermal conductivity, improve storage temperature, and excellent processing performance Effect

Inactive Publication Date: 2020-04-28
SHENZHEN FENGSHENGYUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problem that the thermally conductive gel in the prior art mentioned above has a large amount of residual glue and is not easy to repair, the present invention provides a thermally conductive gel that is easy to repair. By adding white carbon black and a release agent, the thermally conductive gel can be used Curing after heating, reducing residual glue, improving the reworkability of thermally conductive gels, and facilitating production operations

Method used

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  • Easy-to-repair thermal-conducting gel and preparation method thereof
  • Easy-to-repair thermal-conducting gel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Take by weighing 5g of vinyl silicone oil with a viscosity of 500mPa.s, 3g of vinyl MQ resin with a viscosity of 1000mPA.s, 0.5g of hydrophobic white carbon black, and 0.1g of hexadecyltrimethoxysilane, join in the kneader, and Heat the material to 150°C, evacuate until the vacuum degree reaches -0.1MPa, and keep stirring for 180min. After the stirring is completed, cool the mixture to room temperature, add 0.5 g of hydrogen-terminated silicone oil with a hydrogen content of 0.18%, 0.04 g of acetylene cyclohexanol, 15 g of alumina with a particle size of 5 μm, 16 g of alumina with a particle size of 20 μm, and aluminum oxide with a particle size of 40 μm. Aluminum 24g, continue to stir for 30min. Finally, 2000ppm of chloroplatinic acid (based on the mass of platinum) was added, stirred for 30 minutes, and the obtained paste was the finished heat-conducting gel.

Embodiment 2

[0029] Weigh 5g of ethyl silicone oil with a viscosity of 200mPa.s, 3g of vinyl MQ resin of 600mPA.s, 0.5g of hydrophobic white carbon black, and 0.2g of hexadecyltrimethoxysilane, add them to the kneader, and heat the material To 150 degrees, vacuum until the vacuum degree reaches -0.1MPa, and keep stirring for 180min. After the stirring is completed, cool the mixture to room temperature, add 0.7 g of hydrogen-terminated silicone oil with 0.18% hydrogen content, 0.5 g of long-chain alkyl modified silicone oil, 0.04 g of acetylene cyclohexanol, and 15 g of aluminum nitride with a particle size of 5 μm. 16g of 20μm alumina, 20g of 40μm alumina, and continue to stir for 30min. Finally, 2000 ppm of microcapsule-type platinum catalyst (based on the mass of platinum) was added and stirred for 30 minutes, and the obtained paste was the finished heat-conducting gel.

Embodiment 3

[0031] Weigh 5g of ethyl silicone oil with a viscosity of 100mPa.s, 3g of vinyl MQ resin of 500mPA.s, 0.8g of hydrophobic white carbon black, and 0.15g of hexadecyltrimethoxysilane, add them to the kneader, and heat the material To 150 degrees, vacuum until the vacuum degree reaches -0.1MPa, and keep stirring for 180min. After the stirring was completed, the mixture was cooled to room temperature, 2 g of side-chain hydrogen-containing silicone oil with 0.18% hydrogen content, 0.6 g of long-chain aralkyl modified silicone oil, 0.03 g of acetylene cyclohexanol, and 15 g of aluminum nitride with a particle size of 5 μm were added. 20 g of aluminum nitride with a particle size of 20 μm, 10 g of aluminum oxide with a particle size of 20 μm, and 40 g of aluminum oxide with a particle size of 40 μm, and continue to stir for 30 minutes. Finally, 2000 ppm of microcapsule-type platinum catalyst (based on the mass of platinum) was added and stirred for 30 minutes, and the obtained paste ...

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Abstract

The invention discloses an easy-to-repair high-thermal-conducting gel and a preparation method thereof. The easy-to-repair thermal-conducting gel is based on vinyl silicone oil and vinyl MQ resin; a thermal-conducting agent is added, the heat-conducting gel is enabled to have good heat conductivity and certain fluidity as the existing thermal-conducting gel and can be used for filling gaps and irregular parts between electronic components and radiators and has excellent processability and is very suitable for automatic production operation. White carbon black and a release agent are also addedinto the thermal-conducting gel accordingly, the thermal-conducting gel can be cured into a block similar to the thermal-conducting gasket after being heated and has integrity and can be integrally stripped from the PCB and avoids the situation that the thermal-conducting gel remains on the PCB and is difficult to remove and even pollutes other components during repair and improves the repairability of the thermal-conducting gel.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to an easily repairable thermally conductive gel and a preparation method. Background technique [0002] With the integration level of integrated circuits getting higher and higher, the performance is stronger, and the size is getting smaller and smaller, the heat generation of integrated circuits is also increasing. In order to dissipate heat, a variety of thermal interface materials have appeared on the market, such as thermal grease, thermal pads, and thermal gels, all of which have their own advantages and disadvantages. Among them, thermal conductive gel is suitable for use in highly automated production lines because it is easy to automate in production, but there are also problems such as large amount of residual glue and difficult repair, and the existing thermal conductive gel needs to be used at -20 to -10 degrees. Environment storage, also inconvenien...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08L83/05C08K13/04C08K7/26C08K3/22C08K3/28C09K5/14
CPCC08K2003/2227C08K2003/282C08K2201/003C08K2201/014C08L83/04C08L2205/025C08L2205/03C08L2205/035C09K5/14C08K13/04C08K7/26C08K3/22C08K3/28
Inventor 枚望成蒙肇奎
Owner SHENZHEN FENGSHENGYUAN TECH CO LTD
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