Electroplating device and electroplating structure based on tin-silver-copper alloy plating

Abstract

The invention relates to an electroplating device and an electroplating structure based on tin-silver-copper alloy plating. The electroplating device and the electroplating structure comprise an electroplating bath and a control system, wherein a tin layer is arranged on the inner wall of the electroplating bath in a surrounding mode; an electrode rotating mechanism is arranged above the electroplating bath; the control system comprises a rotary speed controller; and the rotary speed controller controls the electrode rotating mechanism to rotate so as to drive a plating article to rotate in the area which the tin layer surrounds. Therefore, according to the electroplating device and the electroplating structure based on tin-silver-copper alloy plating, a stirring device is not required to be installed; only a stationary electrode of a traditional electroplating device is converted into a rotary electrode; besides, the tin layer is arranged around the inner wall of the electroplating bath; in an electroplating process, the plating article can rotate, the concentration difference of electroplating liquids is effectively eliminated, and the structure of the electroplating bath is extremely simplified, so that a disordered state of electrolyte flowing cannot occur in the electroplating process, furthermore, the electroplating effect is enhanced, and the plating layer is enabled to be more flat and uniform; and the structure is simple, the operation is convenient and the enablement is high.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device and an electroplating structure based on tin-silver-copper alloy plating. Background technique [0002] In recent years, the problem of lead pollution in groundwater has become increasingly serious due to the dissolution of lead in the soldering material—Sn-Pb alloy in waste electronic products. With the enhancement of people's awareness of environmental protection, banning the use of lead in the electronic assembly industry has been put on the agenda. Now, the "Administrative Measures for the Control of Pollution by Electronic Information Products" jointly formulated by the Ministry of Information Industry and the State Environmental Protection Administration in my country clearly stipulates that the use of lead and other six toxic and harmful substances in electronic information products is prohibited or restricted. Therefore, in order to better...

AI Technical Summary

Problems solved by technology

However, the existing electroplating devices for tin-silver-copper alloy plating generally use fixed electrodes or other more complicated electroplating structures, which often lead to problems such as uneven coating or complicated operation.

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