Environment-friendly tin plating solution

Abstract

The invention discloses an environment-friendly tin plating solution. The environment-friendly tin plating solution comprises stannous ethanesulfonic acid of 5-30 g / L as organic sulfonic acid tin salt, carboxylic acid of 100-250 g / L as organic acid, thiourea of 50-250 g / L as a complexing agent, 2-naphthol of 1-10 g / L as a reducing agent, nonylphenol ethoxylates of 0.1-5 g / L as a surface active agent, pyrocatechol of 0.1-10 g / L as an antioxidant, magnesium citrate of 20-300 g / L as metal salt, naphthaldehyde of 0.5-3 g / L as a brightener, and the balance deionized water. The formula of the environment-friendly tin plating solution is reasonable, a plated product is good in weldability and thick in plating layer, the thickness of a plating layer can reach 2.5 microns through measurement, the growth of whiskers is effectively restrained, the plating solution is stable in performance, and no harmful matter precipitates out.

Description

technical field [0001] The invention belongs to the technical field of tin plating, and in particular relates to an environment-friendly tin plating solution. Background technique [0002] Tin has good corrosion resistance and welding performance, but its price is high and its workability is poor. Generally, tinning on the metal surface makes it have the excellent performance of tin and the ease of processing of other metals. It is widely used in electronic components and printed circuit boards. , the current electroless tin plating uses commonly used reducing agents because of the high hydrogen evolution potential of tin and low catalytic activity. The plated products have poor solderability, thin coatings, easy damage and low corrosion resistance. Contents of the invention [0003] The object of the present invention is to provide an environment-friendly tin plating solution with reasonable formula, good solderability of the produced product, thick coating and stable pro...

AI Technical Summary

Problems solved by technology

[0002] Tin has good corrosion resistance and welding performance, but its price is high and its workability is poor. Generally, tinning on the metal surface makes it have the excellent performance of tin and the ease of processing of other metals. It is widely used in electronic components and printed circuit boards. , the current electroless tin plating uses commonly used reducing agents because of the high hydrogen evolution potential of tin and low catalytic activity. The plated products have poor solderability, thin coatings, easy damage and low corrosion resistance.