Method adopting photoetching mask lifting method for achieving optical coating

An optical coating and photolithography mask technology, which is applied in the field of optical coating by using the photolithography mask lift-off method, can solve the problems of difficult pattern structure, difficult to control edge shadows within 0.1mm, and white edges at the boundary. , to achieve the effect of precise control

Inactive Publication Date: 2016-02-03
AUXORA SHENZHEN
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Problems solved by technology

Due to the precision of machining and the limitation of material deformation and other factors, the traditional fixture mask is difficult to process and realize the complex submicron structure on the one hand, and on the other hand, it is difficult to control the edge s

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  • Method adopting photoetching mask lifting method for achieving optical coating

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Embodiment Construction

[0014] This embodiment is a preferred implementation mode of the present invention, and other principles and basic structures that are the same or similar to this embodiment are within the protection scope of the present invention.

[0015] The purpose of the present invention is to provide a simple and feasible mask plate technology for the submicron grid-like structure to achieve complex optical characteristics coating requirements, so as to realize precise control of the coating position size of different film structures. To achieve two optical characteristics on the same substrate, please refer to the attached figure 1 , realize a cold light mirror (such as 400nm-700nm high reflection, 750nm-800nm ​​high transparency) in the first zone 1, realize 750nm-800nm ​​light-proof in the second zone 2, and realize 750nm-800nm ​​on the side of the coating surface Band anti-reflection. In order to achieve the above requirements, the technical solution adopted by the present inventio...

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Abstract

The invention relates to a method adopting photoetching mask lifting method for achieving optical coating. The method aims to realize accurate control over sizes of coating positions of different film system structures. Two light characteristics are realized on one substrate, a cold mirror is realized in a first area, light of 750 nm-800 nm cannot be transmitted in a second area, and reflection resistance of wave bands of 750 nm-800 nm is realized on one side of the coating surface. According to the invention, a corresponding photoetching mask plate is manufactured according to the lattice structure, glue application is realized through a traditional spinning-coating mode, dielectric film coating is realized in an ion-source-assisting E-Beam evaporation mode, metal Cr film coating is realized in a magnetron sputtering coating mode, and finally, photoresist is removed by soaking samples in acetone solutions. On the basis that the photoetching technology is maturely applied to the semiconductor industry, the photoetching mask lifting method is gradually applied to optical coating, and accurate control over the submicron-size structure is achieved through the photoetching mask lifting method.

Description

technical field [0001] The invention discloses an optical coating method, in particular a method for realizing optical coating by using a photolithography mask lifting method. Background technique [0002] In the traditional optical thin film coating process, different thin film materials need to be alternately and evenly plated on a substrate, and the same film structure is used to achieve the required optical characteristics. However, for specific requirements in some special fields, different film structures need to be plated on different positions of the substrate to achieve different optical characteristic effects. With the continuous miniaturization of pattern size, when it reaches sub-micron or even smaller size, the traditional method of jig mask or pasting high temperature glue is not applicable. Due to the precision of machining and the limitation of material deformation and other factors, the traditional fixture mask is difficult to process and realize the comple...

Claims

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Application Information

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IPC IPC(8): C23C14/32C23C14/04C23C14/35
Inventor 李京辉唐守利
Owner AUXORA SHENZHEN
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