Electroplate liquid for acid copper plating of triphenylmethane dye system and electroplating method

A technology for triphenylmethane and acid copper plating, which is applied in the field of copper electroplating technology, can solve the problems of restricting the industrial application of acid copper plating, low light travel ability, poor stability of plating solution and the like

Inactive Publication Date: 2016-02-03
无锡永发电镀有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing acidic copper plating generally has technical defects such as poor stability of the plating solution, poor leveling of the coating and low light removal ability, which seriously restrict the industrial application of acidic copper plating

Method used

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  • Electroplate liquid for acid copper plating of triphenylmethane dye system and electroplating method
  • Electroplate liquid for acid copper plating of triphenylmethane dye system and electroplating method
  • Electroplate liquid for acid copper plating of triphenylmethane dye system and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The formulation of the electroplating solution is as follows:

[0040]

[0041] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 2A / dm 2 ; The temperature is 30°C, and the electroplating time is 60min.

Embodiment 2

[0043] The formulation of the electroplating solution is as follows:

[0044]

[0045]

[0046] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 4A / dm 2 ; The temperature is 15°C, and the electroplating time is 50min.

Embodiment 3

[0048] The formulation of the electroplating solution is as follows:

[0049]

[0050] Plating process conditions: the pulse width of the single pulse square wave current is 0.7ms, the duty cycle is 20%, and the average current density is 3A / dm 2 ; The temperature is 25°C, and the electroplating time is 30min.

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PUM

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Abstract

The invention discloses electroplate liquid for acid copper plating of a triphenylmethane dye system and an electroplating method. The electroplate liquid comprises 190-220 g / L of CuSO4 5H2O, 50-70 g / L of H2SO4, 0.050-0.080 g / L of chloridion, 0.15-0.25 g / L of triphenylmethane dye, 0.004-0.008 g / L of benzotriazole, 0.0025-0.005 g / L of ethylene thiourea, 0.01-0.02 g / L of sodium 3,3'-dithiodipropane sulfonate, 0.15-0.30 g / L of polyethylene glycol, 0.01-0.02 g / L of aliphatic amine ethyoxyl sulfonated body and 0.01-0.02 g / L of polyethyleneimine alkyl salt. Triphenylmethane dye serves as a leveling agent of the electroplate liquid, benzotriazole and ethylene thiourea are compounded as a brightener, sodium 3,3'-dithiodipropane sulfonate serves as a grain refiner, polyethyleneimine alkyl salt and aliphatic amine ethyoxyl sulfonated body are compounded as an extension agent, polyethylene glycol serves as a wetting agent, and therefore the electroplate liquid has good stability; and a coating obtained through electroplating of the electroplate liquid under the acid condition is good in leveling performance and high in phototaxis.

Description

technical field [0001] The invention relates to the technical field of copper electroplating technology, in particular to an electroplating solution and an electroplating method for acidic copper plating of a triphenylmethane dye system. Background technique [0002] Copper has good electrical and thermal conductivity, relatively soft, easy to polish, soluble in nitric acid and heated concentrated sulfuric acid, and acts slowly in hydrochloric acid and dilute sulfuric acid. It is easy to oxidize in the air (especially under heating conditions). After oxidation, it will lose its color and luster. It will react with carbon dioxide or oxides in humid air to form a layer of basic copper carbonate. When subjected to the action of sulfide, it will form Brown or black film. [0003] Since copper is more positive, it deposits easily on other metals. Very good corrosion resistant coatings are obtained when used with copper as an underlayer in combination with bright nickel and micr...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 石明
Owner 无锡永发电镀有限公司
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