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Special deplating solution for electronic components electroplating automatic production line

A technology for electronic components and automatic production lines, applied in the direction of electrolytic components, electrolytic processes, cells, etc., can solve problems such as restrictions, large pollution, and greater impact on product quality

Active Publication Date: 2017-12-19
TIANJIN MODERN VOCATIONAL TECH COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional deplating solution is hydrofluoric acid and hydrogen peroxide, and its use is prohibited because of its high pollution.
At present, nitric acid and ferric nitrate stripping solutions are mostly used, and the iron ions in the stripping solution have a great influence on the product quality in the electroplating production line of electronic components, and electronic components have strict restrictions on the content of iron ions. Liquid cannot be used in the production line of electronic components

Method used

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  • Special deplating solution for electronic components electroplating automatic production line
  • Special deplating solution for electronic components electroplating automatic production line
  • Special deplating solution for electronic components electroplating automatic production line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A special deplating solution for an automatic production line of electroplating of electronic components, comprising the following components in parts by weight: 25 parts of nitric acid, 2 parts of corrosion inhibitor, 4 parts of sodium chloride, and 69 parts of water; uniformly mixing the components to obtain electronic components Special deplating solution for component electroplating automatic production line.

[0039] The weight of each component in the corrosion inhibitor is: maleic anhydride 26.9g, acrylic acid 33.1g, initiator 0.2g, terminator 0.1g.

[0040] The preparation method of the corrosion inhibitor: Add water, maleic anhydride, acrylic acid and initiator in sequence in a stainless steel kettle under normal pressure. The initiator is benzoyl peroxide. When the temperature rises to 80°C, the reaction time is 4 hours, and the addition is terminated. agent isopropanol to obtain a corrosion inhibitor.

[0041] H NMR spectra of corrosion inhibitors:

[0042]...

Embodiment 2

[0046] A special deplating solution for an automatic production line of electroplating of electronic components, comprising the following components in parts by weight: 25 parts of nitric acid, 2 parts of corrosion inhibitor, 4 parts of sodium chloride, and 69 parts of water; uniformly mixing the components to obtain electronic components Special deplating solution for component electroplating automatic production line.

[0047] The weight of each component in the corrosion inhibitor is: maleic anhydride 21.7g, acrylic acid 38.3g, initiator 0.3g, terminator 0.1g.

[0048] The preparation method of the corrosion inhibitor: Add water, maleic anhydride, acrylic acid and initiator in sequence in an atmospheric stainless steel kettle. The initiator is benzoyl peroxide. When the temperature rises to 80°C, the reaction time is 6 hours, and the addition is terminated. agent isopropanol to obtain a corrosion inhibitor.

[0049] H NMR spectra of corrosion inhibitors:

[0050] 1H NMR (...

Embodiment 3

[0052] A special deplating solution for an automatic production line of electroplating of electronic components, comprising the following components in parts by weight: 25 parts of nitric acid, 2 parts of corrosion inhibitor, 4 parts of sodium chloride, and 69 parts of water; uniformly mixing the components to obtain electronic components Special deplating solution for component electroplating automatic production line.

[0053] The weight of each component in the corrosion inhibitor is: maleic anhydride 18.2g, acrylic acid 41.8g, initiator 0.4g, terminator 0.1g.

[0054] The preparation method of the corrosion inhibitor: Add water, maleic anhydride, acrylic acid and initiator in sequence in a stainless steel kettle under normal pressure. The initiator is benzoyl peroxide. When the temperature rises to 80°C, the reaction time is 4 hours, and the addition is terminated. agent isopropanol to obtain a corrosion inhibitor.

[0055] H NMR spectra of corrosion inhibitors:

[0056]...

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Abstract

The invention provides a special deplating solution for the electroplating automatic production line of electronic components, which comprises the following components in parts by weight: 15-35 parts of nitric acid, 1-5 parts of corrosion inhibitor, 1-8 parts of solubilizer, and 50-75 parts of water share. The special deplating solution for the automatic production line of electronic component electroplating described in the present invention has good deplating effect, does not corrode the pendant and other deplating carriers at the same time, and has no precipitation when used below the amount of tin stripping, so it is suitable for the automatic production line of electronic component electroplating. Also suitable for stripping production applications in other industries.

Description

technical field [0001] The invention belongs to the field of chemical industry, and in particular relates to a special deplating solution for an electronic component electroplating automatic production line. Background technique [0002] The main function of the deplating solution is to remove the excess tin or nickel and the tin or nickel of the pendant on the equipment, so as to facilitate the normal operation of the production line. At present, the domestic electronics industry uses the deplating solution more widely. In the machinery industry, printed circuit boards, commonly known as PCB industries, are widely used to remove redundant tin plating and tin solder joints. The method of use is manual operation, and the requirements for sediment are not high. The traditional deplating solution is hydrofluoric acid and hydrogen peroxide, and its use is prohibited because of its high pollution. At present, nitric acid and ferric nitrate stripping solutions are mostly used, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/08C23F1/16C23F11/12
Inventor 张克贤牛红军赵秀芬
Owner TIANJIN MODERN VOCATIONAL TECH COLLEGE