Copper electroplating dissolving solution and rapid high-depth blind hole filling process

A solution and copper electroplating technology, applied in the field of circuit boards, can solve the problems of low hole filling rate and uneven copper plating layer, and achieve the effect of high hole filling rate, good ductility and high toughness

Inactive Publication Date: 2016-02-10
FOREWIN FPC SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing electroplating solution in the circuit board industry is used to electroplate blind holes or through holes, the hole fil

Method used

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] Embodiments of the invention include:

[0017] A rapid hole filling process for high-depth blind holes using electroplating copper solution, comprising the following steps:

[0018] Configure electroplating copper solution: use 20L wetting agent, 100L brightener, 100L leveling agent, 2 tons of copper sulfate pentahydrate solution, 2 tons of sulfuric acid solution and 20L hydrochloric acid solution to mix, measure the concentration, add pure water to adjust, so that the electroplating The content of copper sul...

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PUM

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Abstract

The invention discloses a copper electroplating dissolving solution and a rapid high-depth blind hole filling process. The copper electroplating dissolving solution comprises a first additive, a second additive, a blue copperas solution, a sulfuric acid solution, a hydrochloric acid solution and purified water. The rapid high-depth blind hole filling process is completed by preparing the copper electroplating dissolving solution, filling holes in the initial phase, filling the holes in the outburst phase, filling the holes in the recovery stage, and changing current and time. In this way, through the copper electroplating dissolving solution and the rapid high-depth blind hole filling process, the blind holes in a circuit board are plated, the hole filling rate is high and is more than 95%, the surface of a plating is flat, and the flatness reaches over 95%; cavities and seams are avoided in hole filling and copper plating, the surface deposition thickness is small, and the ductility is good; good gloss, high toughness and low internal stress are achieved, and the quality of the circuit board is improved.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a copper electroplating solution and a high-depth blind hole rapid hole filling process. Background technique [0002] Some blind holes or through holes are often provided in PCB and FPC. In order to ensure the electrical conductivity, the inner wall of the blind hole or through hole needs to be plated with copper. [0003] When the existing electroplating solution in the circuit board industry is used to electroplate blind holes or through holes, the hole filling rate is low, and the obtained copper plating layer is not smooth, especially for blind holes with a large depth. Hole technology is improved. Contents of the invention [0004] The technical problem mainly solved by the present invention is to provide a copper electroplating solution and a rapid filling process for high-depth blind holes, so as to improve the copper plating efficiency and surface quality of the high-dep...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/00
CPCC25D3/38C25D7/00
Inventor 曹化要
Owner FOREWIN FPC SUZHOU
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