Thermoplastic polyimide resin powder and preparation method thereof

A technology of polyimide resin and polyimide tree, which is applied in the field of polymer materials, can solve the problems of unsatisfactory long-term use, unsatisfactory long-term use, unsatisfactory heat resistance, etc., and achieve excellent dimensional stability, excellent Effects of melt fluidity and low coefficient of linear expansion

Active Publication Date: 2016-02-17
CHANGZHOU SUNCHEM HIGH FORMANCE POLYMER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of the polyimide resin powder are: poor heat resistance, the glass transition temperature is only about 260°C, and the long-term use temperature is only about 210-220°C, which cannot meet the long-term use requirements of about 280°C
The disadvantages of this

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0023] The preparation method of the thermoplastic polyimide film of the present embodiment has the following steps:

[0024] ①Add 70.61g of 3,3',4,4'-biphenyltetracarboxylic dianhydride (0.24mol), 29.56g of 2,2'-bis[4-(4-aminophenoxy)phenyl]propane (0.072 mol), 37.68 g of 2-(4-aminophenyl)-5-aminobenzimidazole (0.168 mol), and 723g of DMAc was stirred and reacted at a temperature of 10-15°C for 12h to obtain a viscous tan transparent polyamic acid solution.

[0025] ② Add 80g of aprotic organic solvent DMAc and 290g of xylene to the polyamic acid solution obtained in step ①, heat up to reflux (148°C-155°C) and start to carry water until the system is anhydrous and separated. The reflux reaction was continued at high temperature for 2-3 hours, and a large amount of yellow powder precipitated out of the system.

[0026] Stop heating, and naturally cool to below 40° C. to obtain a polyamic acid-polyimide mixed solution.

[0027] ③ Pour the polyamic acid-polyimide mixed soluti...

Embodiment 2～ Embodiment 5）

[0031] The preparation method of each embodiment is basically the same as that of Example 1, and the differences are shown in Table 1.

[0032] Table 1

[0033]

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Abstract

The invention discloses thermoplastic polyimide resin powder and a preparation method thereof. The preparation method comprises the steps that a low-temperature polymerization reaction is performed by adopting s-BPDA, BAPP and 2-(4-aminophenyl)-5-aminobenzimidazole as raw materials under protection of nitrogen in non-proton organic solvent to prepare a polyamic acid solution; organic solvent capable of co-boiling with water and the non-proton organic solvent are added, and a high-temperature polymerization dehydration reaction is performed under the refluxing temperature condition to prepare a polyamide acid-polyimide mixed solution; imidization is performed to obtain the thermoplastic polyimide resin powder. The glass-transition temperature of the finally obtained thermoplastic polyimide resin powder can reach about 330 DEG C and can reach about 280 DEG C if the thermoplastic polyimide resin powder is used for a long term.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a thermoplastic polyimide resin powder and a preparation method thereof. Background technique [0002] Polyimide is one of the varieties with the best comprehensive performance among commercialized high-performance polymers, and is called "problem-solving expert" by the industry. [0003] In the 1960s, DuPont developed the famous VESPEL polyimide plastic, which has excellent heat resistance, creep resistance, chemical resistance, excellent mechanical properties and electrical properties, and has been widely used Used in high-performance components such as electronics, industrial machinery, automobiles, and aircraft. [0004] VESPEL polyimide plastic is made from pyromellitic dianhydride and 4,4’-diphenyl ether diamine, which has poor molding processability and has to be processed in the form of its precursor polyamic acid. And this kind of polyamic acid ha...

Claims

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Application Information

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IPC IPC(8): C08G73/10
Inventor 胡国宜胡锦平吴建华奚小金薛建伟汤卫蒋明跃
Owner CHANGZHOU SUNCHEM HIGH FORMANCE POLYMER
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