A high performance micro-channel heat dissipation structure

Abstract

The invention provides a high performance micro-channel heat dissipation structure comprising a heating element, a micro-channel heat dissipation device and a cover plate. The micro-channel heat dissipation device is tightly attached to the heating element. The cover plate is arranged on the micro-channel heat dissipation device hermetically. The cover plate is provided with at least one heat exchange fluid inlet runner and at least two heat exchange fluid outlet runners. The micro-channel heat dissipation device is provided with a plurality of micro-channels communicating with the heat exchange fluid inlet runner and the heat exchange fluid outlet runners. The micro-channel heat dissipation device is provided with a transition groove corresponding to each heat exchange fluid inlet runner. The high performance micro-channel heat dissipation structure has a higher heat exchange coefficient and heat exchange efficiency; through shunting, flow resistance for fluid is reduced; with the transition grooves, a flow area is increased and side shunting is realized, so that pressure loss is reduced remarkably on the premise that the heat exchange coefficient is not influenced and a higher system operation efficiency can be obtained.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a high-performance micro-groove heat dissipation structure suitable for heat dissipation devices with high heat flux density. Background technique [0002] High-performance electronic chips, power devices, and high-energy LED light-emitting diodes will emit a lot of heat during operation, and the local power can obviously exceed 100W / cm 2 , the performance of conventional cooling methods can not meet the heat dissipation requirements. Micro heat dissipation devices emerged as the times require, through the manufacturing and processing of micro structures to reduce the feature size, and improve the heat transfer coefficient of the cooling fluid, especially the liquid, to achieve the purpose of high power heat dissipation. The structure mainly includes micro-channel, micro-foam metal, silicon-based heat dissipation structure, etc. However, as the size decreases, the pressure differ...

AI Technical Summary

Problems solved by technology

However, as the size decreases, the pressure difference also increases, which is not conducive to the realization of miniature heat dissipation devices

TuckermanandPease et al. verified the low thermal resistance of 0.09 ℃ cm on silicon-based micro-channel heat dissipation devices 2 / W, but the pressure difference reaches 2.1bar, which is difficult to realize

[0003] At present, the traditional micro-channel heat dissipation structure such as figure 1 as shown, figure 1 It is a structural schematic diagram of a traditional micro-channel heat dissipation structure; the existing micro-channel heat dissipation structure adopts a serial direct-flow structure, which has the disadvantages of low heat transfer coefficient and low heat transfer efficiency. structure, the flow area suddenly shrinks, and the flow direction changes, which will cause a large local backflow and pressure difference, resulting in high piezoresistance, affecting the operating efficiency of the overall system, and if the temperature of the heating device is high, boiling will occur at the narrow inlet, will further deteriorate heat transfer and flow

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