Folded external cavity ultra-narrow linewidth semiconductor laser
An ultra-narrow linewidth and laser technology, which is applied to the device for controlling the output parameters of the laser, the structure of the optical resonant cavity, etc., to achieve the effect of not easy mode hopping, narrow laser linewidth, and increased integration
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[0027] Embodiment 1: A method for preparing a folded external cavity ultra-narrow linewidth semiconductor laser, comprising the following steps:
[0028] Step 1: Prepare an InP-based semiconductor laser chip 1 that emits light near a wavelength of 1550 nm.
[0029] Step 2: Use SOI sheet as the folded external cavity 2 chip, SOI is a commercial silicon on insulator chip, its typical structure is the substrate Si, and the isolation layer is SiO 2 , the working layer is Si. The single-wavelength reflective structure 7 is prepared by photolithography. The single-wavelength reflective structure 7 is a first-order grating. The spectral reflection peak of its waveguide is located at 1550nm±1nm, and the reflection bandwidth is smaller than the longitudinal mode interval of the folded external cavity ultra-narrow linewidth semiconductor laser.
[0030] Step 3: Grow a layer of SiO with a thickness of 1 μm by PECVD 2 The single-wavelength reflective structure 7 is protected as a gratin...
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