Cyanide-free gold-plated electroplating liquid and method for electroplating ceramic surface with dense gold thin film through pulses

Abstract

The invention discloses a cyanide-free gold-plated electroplating liquid and method for electroplating the ceramic surface with a dense gold thin film through pulses. The electroplating liquid is prepared from 2-50 g / L of gold organic silicate, 10-120 g / L of 2-sulfo-5,5-dimethyl hydantoin, 10-50 g / L of succinimide, 40-100 g / L of potassium citrate, 10-40 g / L of citric acid, 1-3 g / L of antimony potassium tartrate, 0.5-2 g / L of polyethylene glycol, 20-150 g / L of sodium sulfite and 2-10 g / L of isonicotinic acid. The pH value is 5+ / -0.5. The ceramic pre-plated metal layer surface is electroplated through a square-wave pulse electric potential method or a square-wave pulse current method so that the dense gold thin film can be deposited electrically. The electroplating liquid is high in stability; the plated layer obtained through the pulse electroplating method is highly smooth and dense, uniform in luminance and high in binding force with a ceramic matrix.

Description

technical field [0001] The invention relates to the field of ceramic surface metallization, in particular to a cyanide-free gold plating solution and an electroplating method for pulse electroplating a dense gold film on the ceramic surface. Background technique [0002] With the rapid development of inorganic materials, ceramic materials are more and more widely used in various fields, and the demand for metallization of ceramic surfaces is also increasing. However, due to the non-conductive nature of the ceramic material itself, there are problems such as poor bonding force, difficulty in controlling the surface brightness of the coating, and uneven film thickness in the metallization of the surface. [0003] The cyanide-containing gold plating solution is harmful to the environment and has been gradually replaced by the cyanide-free gold plating solution. However, the existing cyanide-free gold plating solution is generally not stable enough. However, the performance of t...

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: In view of the poor stability of the cyanide-free gold plating solution in the prior art, the poor bonding force between the gold-plated layer on the ceramic surface and the substrate, the difficulty in controlling the surface brightness of the coating and the uneven film thickness, one of the purposes of the present invention is to provide a A kind of stable cyanide-free gold-plating electroplating solution that is applied to ceramic matrix, the second purpose is to provide a kind of method for electroplating compact gold thin film on ceramic surface, make the gold thin film obtained by electrodepositing have good binding force, bright surface, thin layer gold film dense and uniform

[0005] Technical solution: In order to solve the problem of poor stability of the cyanide-free gold plating solution, the present invention adopts the following technical solutions:

Images