Anti-sulfuration plate-type thick film fixed resistor and production method thereof

A technology of fixed resistance and anti-vulcanization sheet, which is applied in the manufacture of thick film resistors, resistors, resistors, etc., can solve the problems of easy vulcanization of electrodes, achieve the effects of not easy vulcanization, low manufacturing cost, and improved performance

Inactive Publication Date: 2016-03-23
株洲宏达电通科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The object of the present invention is: in order to overcome the problem that the surface electrode of the existing chip thick film fixed resistor is easy to vulcanize...

Method used

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  • Anti-sulfuration plate-type thick film fixed resistor and production method thereof

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0025] figure 1 A schematic diagram of the basic structure of the present invention is given, an anti-sulfurization chip thick film fixed resistor, including a ceramic substrate 3, a surface electrode 2, a back electrode 4, a terminal electrode 5, a resistor body 10, and a tin-plated layer 6 , nickel plating layer 7, primary glass 9, secondary glass 8, nickel-chromium isolation layer 1 on the surface electrode. The primary glass is located on the resistor body, and the secondary glass is located on the primary glass. The surface electrode, back electrode, terminal electrode, and resistor body are all located on the ceramic substrate, and the nickel-plated layer is located on the outer surface of the surface electrode, back electrode, and terminal electrode. , the tin layer is located on the outer surface of the nickel layer,

[0026] The present inven...

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Abstract

The invention discloses an anti-sulfuration plate-type thick film fixed resistor and a production method thereof. The anti-sulfuration plate-type thick film fixed resistor comprises a ceramic substrate, a plane electrode, a back electrode, a terminal electrode, a resistor body, a tin coating, a nickel coating, a primary glass, a secondary glass, and a nickel/chromium separating layer positioned on the plane electrode. The production method comprises the following steps: employing a magnetron sputtering technology, during the production of the anti-sulfuration plate-type thick film fixed resistor, a layer of an nickel/chromium alloy is sputtered on the plane electrode before a secondary protective layer is printed, so that sulfuration effect generated by a mode that sulfuration gas is introduced through a slit between the secondary protective layer and the plane electrode and then contacts the plane electrode can be avoided. According to the method, the layer of a nickel/chromium alloy membrane is sputtered on the silver/palladium plane electrode by employing the magnetron sputtering technology, so that anti-sulfuration effect of the plate-type thick film fixed resistor can be achieved, and product performance, reliability and usage life can be enhanced. The plate-type thick film fixed resistor has strong anti-sulfuration capability, sulfuration of the plane electrode does not happen easily, and production cost is low.

Description

technical field [0001] The patent of the present invention relates to the technical field of electronic components, in particular to a new type of chip-type thick-film fixed resistor capable of preventing surface electrodes from being vulcanized by vulcanizing gas in the air and a manufacturing method thereof. Background technique [0002] At present, with the development of electronic technology and military electronic components, as well as the needs of miniaturization, light weight and high performance of modern weapons and equipment, higher requirements are put forward for the performance and reliability of electronic components. As an important basic electronic component, fixed resistors are widely used in the surface mount of small electronic equipment such as mobile communications, notebook computers, handheld computers, computers, and automotive electronics. They are also used in aviation, aerospace, satellites, missiles, sea ( It is widely used in the lines of mil...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C1/142H01C17/065H01C17/28
CPCH01C7/003H01C1/142H01C17/065H01C17/281
Inventor 赵伟利刘宏
Owner 株洲宏达电通科技有限公司
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