Fabrication method of circuit board with back-drilled resin-stuffed holes

A technology of resin plug hole and manufacturing method, which is applied in the fields of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve problems such as difficult process, complicated process, quality risk, etc., and achieve process simplification, simplified process, and low production cost Effect

Active Publication Date: 2016-03-23
广东依顿电子科技股份有限公司
View PDF3 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current production method of back-drilling plug hole circuit boards requires secondary drilling of through-holes, primary back-drilling, secondary copper sinking, and secondary graphic electroplating. The existing technology is only applicable to

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Below in conjunction with specific embodiment the present invention is described in detail:

[0021] A method for making a back-drilled resin plugged circuit board, characterized in that it comprises the following steps:

[0022] 1) Drill the holes and other through holes that need to be back-drilled on the laminated circuit board after the pre-processing;

[0023] The pre-processing of the laminated circuit board includes: material inspection, cutting of the copper clad laminate, exposure and development to form a circuit pattern on the copper clad laminate, drying and then pressing the board to tightly bond the resin rubber with the circuit substrate and copper foil.

[0024] The present invention drills all the holes when drilling the laminated circuit board once, including the holes to be back-drilled and other through holes;

[0025] 2) Immersion copper conducts all holes and vias that need to be back-drilled;

[0026] 3) The whole board is copper-plated, and the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a fabrication method of a circuit board with back-drilled resin-stuffed holes. The method comprises the following steps: drilling through to-be-back-drilled holes and other all through holes on a laminated circuit board which is subjected to front procedure treatment; carrying out copper precipitation conduction on all holes; carrying out the steps of full-plate copper plating, pattern plating, full-plate tinning and the like; electrically testing the back-drilled holes; pasting a dry film on a copper foil surface of the laminated circuit board for sealing the holes; exposing and developing the back-drilled holes requiring resin stuffing; stuffing the back-drilled holes with resin and grinding the resin smooth; taking off the dry film for sealing the holes; and carrying out subsequent procedures of outer circuit pattern transferring and the like. According to the fabrication method disclosed by the invention, selective stuffing of the back-drilled holes can be achieved by sealing the holes with the dry film; the overall process only comprises a one-step through hole drilling process, a one-step copper-deposited plate plating process, a one-step pattern plating process and one-step back-drilling process; the process is simplified; forward and backward transportation between plate-making processes is reduced; and the quality risk in process transportation and plate loading and unloading processes is reduced. An ET test is added before the hole stuffing step, and whether leaking back-drilling and poor back-drilling exist or not is detected, so that the quality is ensured.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing a circuit board with back-drilled resin plug holes, and belongs to the technical field of circuit board production. 【Background technique】 [0002] The copper part of the plated through hole on the circuit board will cause the signal to fold back and resonate, resulting in reflection, scattering, delay, etc. of signal transmission, which will bring distortion to the signal. Using back drilling technology to remove this part of hole copper can improve the signal of electronic products Transmission high frequency, high speed performance. The over-electricity back-drilled holes are exposed to air for a long time and are easy to oxidize. During the packaging process, solder paste may flow into it and affect signal transmission. Therefore, the customer put forward the technical requirements for back-drilled plug holes and then flattening. [0003] The current production method is: pre-order processing -...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0094H05K3/42H05K2201/0959
Inventor 莫介云
Owner 广东依顿电子科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap