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Manufacturing method of high-frequency and high-speed circuit board embedded with heat sink

A production method and circuit board technology, applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., to achieve the effects of stable performance, good combination effect, and accurate positioning

Active Publication Date: 2018-03-06
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantages of ceramic substrates are obvious, such as strong mechanical stress, stable shape, excellent thermal cycle performance, high reliability, etc., but there is a very fatal defect in ceramic materials, which is the problem of brittleness.

Method used

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  • Manufacturing method of high-frequency and high-speed circuit board embedded with heat sink
  • Manufacturing method of high-frequency and high-speed circuit board embedded with heat sink
  • Manufacturing method of high-frequency and high-speed circuit board embedded with heat sink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A method for making a high-frequency and high-speed circuit board embedded with heat sinks, including pressing the plate, drilling, the first gong board, sinking copper, board electricity, outer layer dry film, line electroplating, outer layer etching, inlaying, and the second time Main processes such as gong board, surface treatment, and the third and fourth gong board processes.

[0041] Moreover, in the pressing process, the prepreg with high resin content is selected, the ceramic material is used as the substrate, and the appropriate pressing parameters are set to press the pressing plate material. The parameter setting of the pressure plate is very important. Improper use of the pressure plate parameters is likely to cause defects such as air bubbles, poor pressure plate, and line marks: among them, air bubbles and poor pressure plate are unqualified products, and line marks may cause insufficient peel strength of the outer circuit, serious line marks Make the dril...

Embodiment 2

[0071] A method for making a high-frequency and high-speed circuit board embedded with heat sinks, including pressing the plate, drilling, the first gong board, sinking copper, board electricity, outer layer dry film, line electroplating, outer layer etching, inlaying, and the second time Main processes such as gong board, surface treatment, and the third and fourth gong board processes.

[0072] Moreover, in the pressing process, the prepreg with high resin content is selected, the ceramic material is used as the substrate, and the appropriate pressing parameters are set to press the pressing plate material. The parameter setting of the pressure plate is very important. Improper use of the pressure plate parameters is likely to cause defects such as air bubbles, poor pressure plate, and line marks: among them, air bubbles and poor pressure plate are unqualified products, and line marks may cause insufficient peel strength of the outer circuit, serious line marks Make the dril...

Embodiment 3

[0104] A method for making a high-frequency and high-speed circuit board embedded with heat sinks, including pressing the plate, drilling, the first gong board, sinking copper, board electricity, outer layer dry film, line electroplating, outer layer etching, inlaying, and the second time Main processes such as gong board, surface treatment, and the third and fourth gong board processes.

[0105] Moreover, in the pressing process, the prepreg with high resin content is selected, the ceramic material is used as the substrate, and appropriate pressing parameters are set to press the pressing plate material. The parameter setting of the pressure plate is very important. Improper use of the pressure plate parameters is likely to cause defects such as air bubbles, poor pressure plate, and line marks: among them, air bubbles and poor pressure plate are unqualified products, and line marks may cause insufficient peel strength of the outer circuit, serious line marks Make the drilling...

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Abstract

The invention provides a manufacture method for a high-frequency high-speed circuit board with cooling fins inlaid. The manufacture method comprises the steps of board pressing; drilling; routing for the first time; plating through hole; panel plating; outer dry film; circuit electroplating; outer layer etching; inlaying; routing for the second time; surface treating; routing for the third time; routing for the fourth time and so on. According to the manufacture method for the high-frequency high-speed circuit board with cooling fins inlaid, rapture of the high-frequency high-speed circuit board due to its relatively high brittleness is prevented in drilling and cutting of the board, and the circuit board finally obtained has stable performance and good heat dissipation performance.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a high-frequency and high-speed circuit board embedded with heat sinks. Background technique [0002] With the advancement of electronic design technology and manufacturing technology, electronic products are gradually developing towards high density, high functionality, light and thin, and high transmission rate; coupled with the rapid development of chip miniaturization and the increase in the number of data transmission , the operating frequency of the system is getting higher and higher. For some high-power or low-temperature components, the usual situation is to mount a heat sink on the surface of the heating element. Although this design solves the problem of heat dissipation, it increases the volume of the finished product, which is not conducive to the high concentration of products. Moreover, traditional circuit boards general...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0041H05K3/0061H05K2203/068
Inventor 戴匡
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD