Electronic packaging material
An electronic packaging material and alloy powder technology, applied in the field of aluminum alloy substrate and electronic packaging material, can solve problems such as manufacturing process and welding performance problems, and achieve difficult machining, high thermal conductivity, considerable economic and social benefits. Effect
Inactive Publication Date: 2016-04-06
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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Problems solved by technology
[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials
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[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] In terms of mass fraction, graphene oxide is 0.5% to 3%, SiC particles are 35% to 65%, and the balance is aluminum alloy powder, which contains 50% Al-Si and 50% Al-Ti-B alloy powder. The preparation steps are as follows:
[0030] (1) prepare the ethanol solution of graphene oxide: the graphene oxide of 1 volume and the ethanol of 10 volumes are mixed and dispersed with ultrasonic;
[0031] (2) Add the prepared graphene oxide ethanol solution, SiC particles, and Al-Si aluminum alloy powder into a V-type mixing...
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Abstract
The invention provides an electronic packaging material which is composed of a substrate and a reinforced body. The substrate comprises aluminum alloy. The reinforced body comprises graphene oxide and SiC particles. The electronic packaging material is prepared from, by mass, 0.5%-3% of the graphene oxide, 35%-65% of the SiC particles, and the balance aluminum alloy powder. The aluminum alloy powder comprises 50% of Al-Si alloy powder and 50% of AL-Ti-B alloy powder. The light electronic packaging material with the density being smaller than 3.1 g / cm<3> and the thermal conductivity being larger than 180 W / (m.K) can be prepared, so that the comprehensive performance of military electronic equipment is substantially improved, and the electronic packaging material is suitable for production and preparation of portable devices, military power hybrid circuits in the aerospace field and other fields sensitive to weight, microwave tube carriers, multi-chip module heat sink and super-power module packaging materials.
Description
technical field [0001] The invention relates to an encapsulation material, in particular to an electronic encapsulation material with an aluminum alloy matrix, graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, thermodynamics, machinery and process equipme...
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IPC IPC(8): C22C21/00C22C32/00C22C29/06C22C30/00C22C1/05B22F3/10
CPCB22F3/10C22C1/05C22C1/051C22C21/00C22C29/065C22C30/00C22C32/0063C22C32/0084
Inventor 王旭东罗传彪李炯利王胜强黄粒
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS