A two-phase flow atomization jet cleaning device and cleaning method with gas protection

Abstract

The invention discloses a two-phase flow atomization injection cleaning apparatus with gas protection, and a cleaning method. A nozzle main body is internally provided with a multipath liquid diversion pipeline with a liquid guiding outlet at a preset angle and a gas-outlet web plate with a vertical gas guiding outlet, an injected high-speed liquid flow and a high-speed gas flow are enabled to fully act on each other, ultramicro atomization liquid drops with uniform and adjustable particle dimensions are formed, the ultramicro atomization liquid drops are sprayed to the surface of a wafer under the acceleration and guiding effects of an orientation atomization particle guiding outlet, at the same time, a protection gas outlet encircles the atomization particle guiding outlet and is aslant arranged downwards towards the outer side for injecting a protection gas, and mobile atomization cleaning can be performed on the wafer under gas protection. According to the invention, the atomization particle dimensions can be greatly reduced, energy is reduced, damage to the figure structure of the surface of the wafer can be prevented, the content of oxygen in a cleaning chamber in a cleaning technical process can be controlled, the possibility of a water mark defect is reduced, and the cleaning quality and the efficiency are improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor cleaning equipment, more specifically, to a two-phase flow atomization jet cleaning device with gas protection and a cleaning method using the device. Background technique [0002] With the rapid development of semiconductor integrated circuit manufacturing technology, the graphic feature size of integrated circuit chips has entered the deep sub-micron stage, and the feature size of key contaminants (such as particles) that cause failure or damage to ultra-fine circuits on the chip has also increased. greatly reduced. [0003] During the manufacturing process of integrated circuits, semiconductor wafers usually go through multiple process steps such as film deposition, etching, and polishing. And these process steps just become the important place that the contamination produces. In order to maintain the clean state of the wafer surface and eliminate the contaminants deposited on t...

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Problems solved by technology

[0011] The purpose of the present invention is to overcome the above-mentioned defects existing in the prior art, to provide a two-phase flow atomization jet cleaning device and cleaning method with gas protection, and to design a new combination of gas protection and two-phase flow atomization jet cleaning The nozzle structure can not only effectively solve the problem of damage to the side wall and corner of the wafer pattern, but also isolate the wafer from oxygen during the process, prevent the silicon material on the wafer surface from being oxidized, and better realize the The range of drying prevents the occurrence of water mark defects and improves cleaning quality and efficiency

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