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Method and device for optimizing chemical nickel-palladium-gold coating

A technology of chemical nickel and palladium, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve problems such as product hidden dangers, virtual soldering, open circuit, etc., to improve printing efficiency, avoid waste, and improve efficiency Effect

Inactive Publication Date: 2016-05-04
WEIFANG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the addition of the palladium layer in the protective coating, if the process parameters for forming solder joints do not change accordingly, a series of failure modes will occur, which will bring hidden dangers to the product.
[0003] To connect SMD components and PCB pads together to form good and reliable solder joints, steps such as printing solder paste, placing SMD components, and reflow soldering are required, the most important of which is the process of printing solder paste. If solder paste If the amount of printing is too small, the strength of the solder joints may be insufficient, and even open circuits may occur; if the amount of solder paste is too large, bridging may occur and cause short circuits
If there are defects in the solder paste printing quality, the component placement accuracy and welding temperature profile in the subsequent SMT production process are difficult to compensate for potential soldering quality defects

Method used

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  • Method and device for optimizing chemical nickel-palladium-gold coating
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  • Method and device for optimizing chemical nickel-palladium-gold coating

Examples

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Effect test

Embodiment 1

[0033]The invention provides a method for optimizing the chemical nickel-palladium-gold coating, comprising the following steps: (1) the lower surface of the steel template is covered with air-permeable cloth. Apply vaseline around the lower surface of the stencil to increase the combination of the air-permeable cloth and the steel stencil. The width of the air-permeable cloth needs to be equivalent to the surface area of ​​the steel stencil. The specifications and parameters of the air-permeable cloth are not limited here, as long as it meets the air permeability and does not make the solder paste leak out. Yes, those skilled in the art can choose by themselves according to needs; (2) place the steel formwork on the workbench, which is provided with a gap matching the shape of the steel formwork, and when the steel formwork is transported to the position of the notch, the steel formwork The upper surface is attached to the lower surface of the workbench. There is a material bo...

Embodiment 2

[0035] Such as figure 1 with figure 2 Commonly shown, the present invention also provides a kind of equipment of optimization chemical nickel-palladium-gold coating, comprises the film covering mechanism 1 that the lower surface of steel template 4 is covered with air-permeable cloth 8, before covering air-permeable cloth 8, needs to clean steel plate earlier The lower surface of the formwork 4, and then apply vaseline around the lower surface of the steel formwork 4 to increase the combination of the breathable cloth 8 and the steel formwork 4. The format of the breathable cloth 8 needs to be equivalent to the surface area of ​​the steel formwork 4. It is not limited here, as long as the ventilation is satisfied without the solder paste leaking out, those skilled in the art can choose by themselves according to the needs, the downstream of the coating mechanism 1 is provided with a conveyor belt 2 for conveying the steel template 4, and the tail end of the conveyor belt 2 T...

Embodiment 3

[0045] Such as Figure 5 As shown, the present invention also provides a device for optimizing the chemical nickel-palladium-gold coating, the structure of which is basically the same as that of the second embodiment, including the technical solution of the second embodiment, and further improved on the basis of the second embodiment, specifically The scheme is as follows:

[0046] The workbench 5 is set in a closed ring shape, and flanges are provided on the inner and outer periphery of the workbench 5, and a motor is set at the center of the workbench 5 to drive the rotating shaft 21, and several support arms 22 are fixedly installed on the rotating shaft 21, A material box 3 is fixed on each support arm 22, and several tangentially arranged conveyor belts 2 are arranged on the workbench 5. Steel templates 4 are set on the conveyor belt 2, and a gap, the rotating shaft 21 rotates in one direction, which can drive the material box 3 to circulate to apply pressure to the stee...

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Abstract

The invention discloses a method and device for optimizing a chemical nickel-palladium-gold coating and belongs to the technical field of electroplating. The device comprises a laminating mechanism, wherein the laminating mechanism is used for coating the lower surface of a steel mold plate with breathable cloth. A conveying belt used for conveying the steel mold plate is arranged on the downstream portion of the laminating mechanism. A rolling mechanism used for stripping the breathable cloth on the steel mold plate is arranged at the tail end of the conveying belt. A working table is arranged between the laminating mechanism and the rolling mechanism. A notch matched with the steel mold plate in shape is formed in the working table. A material box is arranged on the working table. A partition board is arranged in the material box. The material box is divided into a paste storage cavity and a sundry storage cavity by the partition board. A scraper is vertically arranged on the partition board. A file is arranged on the material box and located in the sundry storage cavity. A demolding mechanism used for discharging tin paste on the steel mold plate is arranged on the downstream portion of the rolling mechanism. By the adoption of the method and device for optimizing the chemical nickel-palladium-gold coating, the technical effects of pressing the tin paste in a mold hole of the steel mold plate evenly and rapidly and transferring the tin paste onto a printed circuit board (PCB) bonding pad are achieved, and the method and device are widely applied to the electronic industry.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a method and equipment for optimizing chemical nickel-palladium-gold plating. Background technique [0002] With the promotion and popularization of the EU RoHS standard, tin-lead solder has been basically eliminated in the electronics industry, which opens up a broad application space for PCBs that are surface-treated by the chemical nickel-palladium-gold process. However, due to the addition of the palladium layer in its protective coating, if the process parameters for forming solder joints do not change thereupon, a series of failure modes will occur, which will bring hidden dangers to the product instead. [0003] To connect SMD components and PCB pads together to form good and reliable solder joints, steps such as printing solder paste, placing SMD components, and reflow soldering are required, the most important of which is the process of printing solder paste. If s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/50
CPCC23C18/50
Inventor 于金伟
Owner WEIFANG UNIVERSITY
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